P

Inventor

HUANG YAO-TE

TW46 patents
⚠️ This page may combine multiple inventors who share the name “HUANG YAO-TE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

19 patents
US10266390B2Apr 23, 2019

Methods of forming micro-electro-mechanical devices including a conductive feature extending through an escort ring

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11764143B2Sep 19, 2023

Increasing contact areas of contacts for MIM capacitors

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10779100B2Sep 15, 2020

Method for manufacturing a microphone

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US12538794B2Jan 27, 2026

Increasing contact areas of contacts for MIM capacitors

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11678133B2Jun 13, 2023

Structure for integrated microphone

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11130670B2Sep 28, 2021

MEMS devices with an element having varying widths

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US9998843B2Jun 12, 2018

Method for manufacturing a microphone

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US9462402B2Oct 4, 2016

Monolithic complementary metal-oxide semiconductor (CMOS)-integrated silicon microphone

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations62
US9269679B2Feb 23, 2016

Wafer level packaging techniques

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations62
US12283532B2Apr 22, 2025

Semiconductor structure and method of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11443991B2Sep 13, 2022

Semiconductor structure and method of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11908829B2Feb 20, 2024

Integrated circuit package and method of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12230603B2Feb 18, 2025

Method of fabricating a semiconductor chip having strength adjustment pattern in bonding layer

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US12142574B2Nov 12, 2024

Semiconductor devices and methods of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US11756924B2Sep 12, 2023

Method of fabricating a semiconductor chip having strength adjustment pattern in bonding layer

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US9673169B2Jun 6, 2017

Method and apparatus for a wafer seal ring

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations51
US9584003B2Feb 28, 2017

Energy-harvesting device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9545691B2Jan 17, 2017

Method of removing waste of substrate and waste removing device thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10273148B2Apr 30, 2019

Micro-electro-mechanical system and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations41

TAIWAN SEMICONDUCTOR MFG

8 patents

XYZPRINTING INC

4 patents

HUANG YAO-TE

3 patents

HUANG HSIN-TING

2 patents

CHUNG TIEN-KAN

2 patents

KINPO ELECT INC

2 patents

TSAI SHANG-YING

2 patents

CHUNGHWA TELECOM CO LTD

1 patent

QISDA CORP

1 patent

TSAI WEN-TIEN

1 patent

CHEN YUNG-CHUAN

1 patent