Inventor
HUANG YAO-TE
TW46 patents
⚠️ This page may combine multiple inventors who share the name “HUANG YAO-TE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
19 patentsUS10266390B2Apr 23, 2019
Methods of forming micro-electro-mechanical devices including a conductive feature extending through an escort ring
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11764143B2Sep 19, 2023
Increasing contact areas of contacts for MIM capacitors
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10779100B2Sep 15, 2020
Method for manufacturing a microphone
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US12538794B2Jan 27, 2026
Increasing contact areas of contacts for MIM capacitors
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11678133B2Jun 13, 2023
Structure for integrated microphone
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11130670B2Sep 28, 2021
MEMS devices with an element having varying widths
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US9998843B2Jun 12, 2018
Method for manufacturing a microphone
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US9462402B2Oct 4, 2016
Monolithic complementary metal-oxide semiconductor (CMOS)-integrated silicon microphone
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations62
US9269679B2Feb 23, 2016
Wafer level packaging techniques
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations62
US12283532B2Apr 22, 2025
Semiconductor structure and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11443991B2Sep 13, 2022
Semiconductor structure and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11908829B2Feb 20, 2024
Integrated circuit package and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12230603B2Feb 18, 2025
Method of fabricating a semiconductor chip having strength adjustment pattern in bonding layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US12142574B2Nov 12, 2024
Semiconductor devices and methods of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US11756924B2Sep 12, 2023
Method of fabricating a semiconductor chip having strength adjustment pattern in bonding layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US9673169B2Jun 6, 2017
Method and apparatus for a wafer seal ring
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations51
US9584003B2Feb 28, 2017
Energy-harvesting device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9545691B2Jan 17, 2017
Method of removing waste of substrate and waste removing device thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10273148B2Apr 30, 2019
Micro-electro-mechanical system and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations41
TAIWAN SEMICONDUCTOR MFG
8 patentsUS8377798B2Feb 19, 2013
Method and structure for wafer to wafer bonding in semiconductor packaging
TAIWAN SEMICONDUCTOR MFG222 citations99
US9181083B2Nov 10, 2015
MEMS devices and methods of forming the same
TAIWAN SEMICONDUCTOR MFG52 citations97
US8928162B2Jan 6, 2015
Sensor with energy-harvesting device
TAIWAN SEMICONDUCTOR MFG4 citations83
US8841201B2Sep 23, 2014
Systems and methods for post-bonding wafer edge seal
TAIWAN SEMICONDUCTOR MFG12 citations83
US9264833B2Feb 16, 2016
Structure and method for integrated microphone
TAIWAN SEMICONDUCTOR MFG2 citations62
US9034677B2May 19, 2015
MEMS device and method of formation thereof
TAIWAN SEMICONDUCTOR MFG0 citations52
US9246401B2Jan 26, 2016
Energy-harvesting device and method of forming the same
TAIWAN SEMICONDUCTOR MFG0 citations51
US8763220B2Jul 1, 2014
Method of manufacturing a MEMS device
TAIWAN SEMICONDUCTOR MFG0 citations51
XYZPRINTING INC
4 patentsUS9718239B2Aug 1, 2017
Three dimensional printing apparatus and three dimensional printing method
XYZPRINTING INC4 citations73
US10252464B2Apr 9, 2019
Slicing printing method for color 3D model
XYZPRINTING INC1 citations61
US9981427B2May 29, 2018
Sensing device for three-dimensional printing object
XYZPRINTING INC0 citations52
US10343391B2Jul 9, 2019
Three-dimensional printing apparatus and three-dimensional printing method
XYZPRINTING INC0 citations40