Inventor
HUANG HSIN-TING
TW35 patents
⚠️ This page may combine multiple inventors who share the name “HUANG HSIN-TING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
18 patentsUS9567204B2Feb 14, 2017
Microelectrochemical systems (MEMS) device having a seal layer arranged over or lining a hole in fluid communication with a cavity of the MEMS device
TAIWAN SEMICONDUCTOR MFG CO LTD18 citations92
US10392244B2Aug 27, 2019
Method for sealing a cavity of a microelectromechanical systems (MEMS) device using a seal layer covering or lining a hole in fluid communication with the cavity
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US10131540B2Nov 20, 2018
Structure and method to mitigate soldering offset for wafer-level chip scale package (WLCSP) applications
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US9656857B2May 23, 2017
Microelectromechanical systems (MEMS) devices at different pressures
TAIWAN SEMICONDUCTOR MFG CO LTD13 citations84
US10464808B2Nov 5, 2019
Semiconductor arrangement and formation thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10266390B2Apr 23, 2019
Methods of forming micro-electro-mechanical devices including a conductive feature extending through an escort ring
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9845236B2Dec 19, 2017
Monolithic MEMS platform for integrated pressure, temperature, and gas sensor
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9776858B2Oct 3, 2017
Semiconductor arrangement and formation thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9630832B2Apr 25, 2017
Semiconductor device and method of manufacturing
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations73
US11130670B2Sep 28, 2021
MEMS devices with an element having varying widths
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10981781B2Apr 20, 2021
Semiconductor arrangement and formation thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US9856139B2Jan 2, 2018
Microelectromechanical systems (MEMS) devices at different pressures
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations52
US9714166B2Jul 25, 2017
Thin film structure for hermetic sealing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9533876B2Jan 3, 2017
MEMS structures and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9422151B1Aug 23, 2016
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations52
US9673169B2Jun 6, 2017
Method and apparatus for a wafer seal ring
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations51
US9584003B2Feb 28, 2017
Energy-harvesting device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10266395B2Apr 23, 2019
Semiconductive structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations42
TAIWAN SEMICONDUCTOR MFG
9 patentsUS8377798B2Feb 19, 2013
Method and structure for wafer to wafer bonding in semiconductor packaging
TAIWAN SEMICONDUCTOR MFG222 citations99
US9181083B2Nov 10, 2015
MEMS devices and methods of forming the same
TAIWAN SEMICONDUCTOR MFG52 citations97
US9202792B2Dec 1, 2015
Structure and method of providing a re-distribution layer (RDL) and a through-silicon via (TSV)
TAIWAN SEMICONDUCTOR MFG7 citations84
US8928162B2Jan 6, 2015
Sensor with energy-harvesting device
TAIWAN SEMICONDUCTOR MFG4 citations83
US8841201B2Sep 23, 2014
Systems and methods for post-bonding wafer edge seal
TAIWAN SEMICONDUCTOR MFG12 citations83
US9355896B2May 31, 2016
Package systems
TAIWAN SEMICONDUCTOR MFG2 citations63
US9112001B2Aug 18, 2015
Package systems and manufacturing methods thereof
TAIWAN SEMICONDUCTOR MFG1 citations63
US9034677B2May 19, 2015
MEMS device and method of formation thereof
TAIWAN SEMICONDUCTOR MFG0 citations52
US9246401B2Jan 26, 2016
Energy-harvesting device and method of forming the same
TAIWAN SEMICONDUCTOR MFG0 citations51