Inventor

TSAI SHANG-YING

TW91 patents

⚠️ This page may combine multiple inventors who share the name “TSAI SHANG-YING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TSAI SHANG-YING

TAIWAN SEMICONDUCTOR MFG CO LTD

MEMS devices including MEMS dies and connectors thereto

Method to produce chemical pattern in micro-fluidic structure

Method of making ohmic contact on low doped bulk silicon for optical alignment

MEMS devices including MEMS dies and connectors thereto

Method of stiction prevention by patterned anti-stiction layer

MEMS devices including MEMS dies and connectors thereto

Methods of forming micro-electro-mechanical devices including a conductive feature extending through an escort ring

Microelectromechanical system device and method for manufacturing the same

MEMS device with dummy-area utilization for pressure enhancement

Semiconductive structure and manufacturing method thereof

Method of making ohmic contact on low doped bulk silicon for optical alignment

Method of making ohmic contact on low doped bulk silicon for optical alignment

MEMS device with dummy-area utilization for pressure enhancement

Fluid deposition apparatus and method

Stopper bump structures for MEMS device

Semiconductor structure and manufacturing method thereof

MEMS apparatus with anti-stiction layer

MEMS devices with an element having varying widths

MEMS devices including MEMS dies and connectors thereto

MEMS devices and methods of fabrication thereof

Wafer level packaging techniques

Die attached leveling control by metal stopper bumps

Die attached leveling control by metal stopper bumps

Composite spring structure to reinforce mechanical robustness of a MEMS device

Die attached leveling control by metal stopper bumps

TAIWAN SEMICONDUCTOR MFG

Method and structure for wafer to wafer bonding in semiconductor packaging

Triple-axis MEMS accelerometer

MEMS devices and methods of forming the same

Method to produce chemical pattern in micro-fluidic structure

MEMS devices and methods for forming same

Semiconductor device

Sensor with energy-harvesting device

Systems and methods for post-bonding wafer edge seal

Method of making flowcell with micro-fluid structure

Method for reducing chip warpage

Package systems

Semiconductor device with through molding vias

Package systems and manufacturing methods thereof

Silicon undercut prevention in sacrificial oxide release process and resulting MEMS structures

Multi-step process for forming high-aspect-ratio holes for MEMS devices

ILLUMINA INC

Method to produce chemical pattern in micro-fluidic structure

Method to produce chemical pattern in micro-fluidic structure

Method to produce chemical pattern in micro-fluidic structure

WU TING-HAU

Method for reducing chip warpage

Method to produce 3-D optical gyroscope my MEMS technology

MEMS microphone with single polysilicon film

PENG JUNG-HUEI

MEMS devices and methods of fabrication thereof

LIU PING-YIN

Self-removal anti-stiction coating for bonding process

HUANG HSIN-TING

Method of fabricating a semiconductor device having recessed bonding site

SHU CHIA-PAO

Package systems having a eutectic bonding material and manufacturing methods thereof