Inventor

SADAKA MARIAM

US39 patents

⚠️ This page may combine multiple inventors who share the name “SADAKA MARIAM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SADAKA MARIAM

SOITEC SILICON ON INSULATOR

Methods of forming three-dimensionally integrated semiconductor systems including photoactive devices and semiconductor-on-insulator substrates

Method for fabricating semiconductor structures including fin structures with different strain states, and related semiconductor structures

Method for fabricating semiconductor structures including transistor channels having different strain states, and related semiconductor structures

Bonded processed semiconductor structures and carriers

Methods of forming bonded semiconductor structures

Bonded semiconductor structures including two or more processed semiconductor structures carried by a common substrate

Method for fabricating semiconductor structures including fin structures with different strain states, and related semiconductor structures

Bonded processed semiconductor structures and carriers

Methods of fabricating semiconductor structures including cavities filled with a sacrificial material

Semiconductor structures including fluidic microchannels for cooling and related methods

Method for fabricating semiconductor structures including fin structures with different strain states, and related semiconductor structures

Methods of fabricating semiconductor structures including cavities filled with a sacrificial material

Methods for fabrication of semiconductor structures using laser lift-off process, and related semiconductor structures

Methods of forming III-V semiconductor structures using multiple substrates, and semiconductor devices fabricated using such methods

Low temperature layer transfer process using donor structure with material in recesses in transfer layer, semiconductor structures fabricated using such methods

Methods of forming semiconductor structures including MEMS devices and integrated circuits on common sides of substrates, and related structures and devices

Methods of forming semiconductor structures including MEMS devices and integrated circuits on opposing sides of substrates, and related structures and devices

SADAKA MARIAM

Methods for bonding semiconductor structures involving annealing processes, and bonded semiconductor structures and intermediate structures formed using such methods

Bonding surfaces for direct bonding of semiconductor structures

Methods for bonding semiconductor structures involving annealing processes, and bonded semiconductor structures formed using such methods

Methods of forming bonded semiconductor structures using a temporary carrier having a weakened ion implant region for subsequent separation along the weakened region

Interposers including fluidic microchannels and related structures and methods

Methods for fabrication of semiconductor structures including interposers with conductive vias, and related structures and devices

Methods of transferring layers of material in 3D integration processes and related structures and devices

Methods of forming bonded semiconductor structures

Methods of forming bonded semiconductor structures including two or more processed semiconductor structures carried by a common substrate, and semiconductor structures formed by such methods

Bonded semiconductor structures and methods of forming same

Methods for directly bonding together semiconductor structures, and bonded semiconductor structures formed using such methods

Semiconductor structures including fluidic microchannels for cooling and related methods

Methods of providing thin layers of crystalline semiconductor material, and related structures and devices

Methods of forming bonded semiconductor structures in 3D integration processes using recoverable substrates, and bonded semiconductor structures formed by such methods

Methods and structures for forming integrated semiconductor structures

NGUYEN BICH-YEN

Methods of forming three dimensionally integrated semiconductor systems including photoactive devices and semiconductor-on-insulator substrates

Methods of forming bonded semiconductor structures including interconnect layers having one or more of electrical, optical, and fluidic interconnects therein, and bonded semiconductor structures formed using such methods

BOURDELLE KONSTANTIN

Hybrid semiconductor substrate including semiconductor-on-insulator region and method of making the same

TAIWAN SEMICONDUCTOR MFG

High performance transistors with hybrid crystal orientations

SONY SEMICONDUCTOR SOLUTIONS CORP

Methods of forming bonded semiconductor structures, and semiconductor structures formed by such methods

APPLE INC

Trench process for dense VCSEL design

MAZURE CARLOS

Bonded semiconductor structures and method of forming same