P

Inventor

TAKANO TAKAMASA

JP26 patents
⚠️ This page may combine multiple inventors who share the name “TAKANO TAKAMASA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DAINIPPON PRINTING CO LTD

22 patents
US10586768B2Mar 10, 2020

Line structure and a method for producing the same

DAINIPPON PRINTING CO LTD5 citations84
US10121748B2Nov 6, 2018

Line structure and a method for producing the same

DAINIPPON PRINTING CO LTD7 citations84
US9735108B2Aug 15, 2017

Line structure and a method for producing the same

DAINIPPON PRINTING CO LTD7 citations84
US11195768B2Dec 7, 2021

Through electrode substrate, manufacturing method thereof and mounting substrate

DAINIPPON PRINTING CO LTD2 citations73
US10957592B2Mar 23, 2021

Through electrode substrate, method of manufacturing through electrode substrate, and mounting substrate

DAINIPPON PRINTING CO LTD2 citations73
US12394680B2Aug 19, 2025

Through electrode substrate, manufacturing method thereof and mounting substrate

DAINIPPON PRINTING CO LTD0 citations62
US12255145B2Mar 18, 2025

Multi-layer line structure

DAINIPPON PRINTING CO LTD0 citations62
US12136591B2Nov 5, 2024

Through electrode substrate and semiconductor device

DAINIPPON PRINTING CO LTD0 citations62
US11862564B2Jan 2, 2024

Multi-layer line structure and method for manufacturing thereof

DAINIPPON PRINTING CO LTD0 citations62
US11810820B2Nov 7, 2023

Through electrode substrate, method of manufacturing through electrode substrate, and mounting substrate

DAINIPPON PRINTING CO LTD0 citations62
US11742273B2Aug 29, 2023

Through electrode substrate and semiconductor device

DAINIPPON PRINTING CO LTD0 citations62
US11373906B2Jun 28, 2022

Through electrode substrate, method of manufacturing through electrode substrate, and mounting substrate

DAINIPPON PRINTING CO LTD0 citations62
US11217530B2Jan 4, 2022

Line structure and a method for producing the same

DAINIPPON PRINTING CO LTD0 citations62
US11069618B2Jul 20, 2021

Line structure and a method for producing the same

DAINIPPON PRINTING CO LTD0 citations62
US10950533B2Mar 16, 2021

Through electrode substrate and semiconductor device

DAINIPPON PRINTING CO LTD0 citations62
US10014244B2Jul 3, 2018

Through-hole electrode substrate

DAINIPPON PRINTING CO LTD1 citations62
US11430730B2Aug 30, 2022

Wiring substrate and semiconductor device

DAINIPPON PRINTING CO LTD0 citations55
US12119293B2Oct 15, 2024

Through electrode substrate and mounting substrate

DAINIPPON PRINTING CO LTD0 citations52
US10600728B2Mar 24, 2020

Through-hole electrode substrate

DAINIPPON PRINTING CO LTD0 citations51
US9443788B2Sep 13, 2016

Through-hole electrode substrate

DAINIPPON PRINTING CO LTD0 citations51
US10712453B2Jul 14, 2020

Detection element

DAINIPPON PRINTING CO LTD0 citations41
US9209319B2Dec 8, 2015

Sensor device manufacturing method and sensor device

DAINIPPON PRINTING CO LTD0 citations41

TAKANO TAKAMASA

2 patents

NAKAYAMA KOICHI

2 patents