Through-hole electrode substrate

Abstract

A method of manufacturing a through-hole electrode substrate includes forming a plurality of through-holes in a substrate, forming a plurality of through-hole electrodes by filling a conductive material into the plurality of through-holes, forming a first insulation layer on one surface of the substrate, forming a plurality of first openings which expose the plurality of through-hole electrodes corresponding to each of the plurality of through-hole electrodes, on the first insulation layer and correcting a position of the plurality of first openings using the relationship between a misalignment amount of a measured distance value of an open position of a leaning through-hole among the plurality of through-holes and of a design distance value of the open position of the leaning through-hole among the plurality of through-holes with respect to a center position of the substrate.

What is claimed is: 
     
       1. A through-hole electrode substrate comprising:
 a substrate including at least one through-hole, the substrate and the through-hole having an insulation surface; 
 a through-hole electrode arranged within the through-hole; 
 a first insulation layer arranged on the surface of the substrate, having an opening on the through-hole electrode, and covering at least one part of a boundary section between the through-hole and the through-hole electrode; and 
 a seed layer arranged on a surface of the first insulation layer, wherein the first insulation layer extends along the surface of the substrate beyond the width of the seed layer. 
 
     
     
       2. The through-hole electrode substrate according to  claim 1 , wherein an outer boundary line of the opening being arranged on the through-hole electrode. 
     
     
       3. The through-hole electrode substrate according to  claim 1 , wherein the first insulation layer is a resin layer. 
     
     
       4. The through-hole electrode substrate according to  claim 3 , wherein the resin layer includes an inorganic filler. 
     
     
       5. The through-hole electrode substrate according to  claim 3 , wherein an area of the resin layer in contact with the through-hole electrode which is exposed on the surface of the substrate is 20% to 80% with respect to the entire exposed area of the through-hole electrode. 
     
     
       6. The through-hole electrode substrate according to  claim 3 , wherein a thickness of the resin layer is 1 μm to 20 μm. 
     
     
       7. The through-hole electrode substrate according to  claim 3 , wherein a thickness of the resin layer is 3 μm to 8 μm. 
     
     
       8. The through-hole electrode substrate according to  claim 3 , wherein the resin layer has a gas discharge function which discharges the gas which is discharged from the through-hole electrode to the exterior. 
     
     
       9. The through-hole electrode substrate according to  claim 8 , wherein the gas includes H 2  or H 2 O. 
     
     
       10. The through-hole electrode substrate according to  claim 1 , wherein the substrate is a silicon substrate covered with an insulation film. 
     
     
       11. The through-hole electrode substrate according to  claim 1 , further comprising:
 a conduction layer arranged on the first insulation layer, and connected with the through-hole electrode via the opening. 
 
     
     
       12. The through-hole electrode substrate according to  claim 1 , wherein the through hole electrode includes a copper. 
     
     
       13. The through-hole electrode substrate according to  claim 1 , wherein the through-hole electrode is filled into the through-hole. 
     
     
       14. An electrical circuit board comprising:
 the through-hole electrode substrate in  claim 1 ; 
 a first board arranged on one surface of the through-hole electrode substrate, and electrically connected with the through-hole electrode; 
 a second board arranged on the other surface of the through-hole electrode substrate, and electrically connected with the through-hole electrode, the second board and the first board being electrically connected via the through-hole electrode.