Inventor · disambiguated record
Takamasa Takano
Also filed as: TAKANO TAKAMASA
26 granted patents·5 pending applications·65 citations·filing 2009–2025
94Inventor score
Top patents by PatentIndex Score
31 records- 0194US10121748B2Line structure and a method for producing the sameDAINIPPON PRINTING CO LTD·Filed 2017·Granted Nov 6, 2018·7 cites·5 claims
- 0294US9476898B2Sensor device and manufacturing method thereofTAKANO TAKAMASA·Filed 2012·Granted Oct 25, 2016·34 cites·17 claims
- 0393US10586768B2Line structure and a method for producing the sameDAINIPPON PRINTING CO LTD·Filed 2018·Granted Mar 10, 2020·5 cites·15 claims
- 0493US9735108B2Line structure and a method for producing the sameDAINIPPON PRINTING CO LTD·Filed 2015·Granted Aug 15, 2017·7 cites·27 claims
- 0587US12255145B2Multi-layer line structureDAINIPPON PRINTING CO LTD·Filed 2023·Granted Mar 18, 2025·0 cites·10 claims
- 0685US2025349635A1Through electrode substrate, manufacturing method thereof and mounting substrateDAINIPPON PRINTING CO LTD·Filed 2025·Application pending·0 cites
- 0784US2025210524A1Multi-layer line structureDAINIPPON PRINTING CO LTD·Filed 2025·Application pending·0 cites
- 0882US10957592B2Through electrode substrate, method of manufacturing through electrode substrate, and mounting substrateDAINIPPON PRINTING CO LTD·Filed 2017·Granted Mar 23, 2021·2 cites·13 claims
- 0980US11195768B2Through electrode substrate, manufacturing method thereof and mounting substrateDAINIPPON PRINTING CO LTD·Filed 2017·Granted Dec 7, 2021·2 cites·23 claims
- 1080US2025014979A1Through electrode substrate and mounting substrateDAINIPPON PRINTING CO LTD·Filed 2024·Application pending·0 cites
- 1179US12136591B2Through electrode substrate and semiconductor deviceDAINIPPON PRINTING CO LTD·Filed 2023·Granted Nov 5, 2024·0 cites·18 claims
- 1277US11862564B2Multi-layer line structure and method for manufacturing thereofDAINIPPON PRINTING CO LTD·Filed 2021·Granted Jan 2, 2024·0 cites·25 claims
- 1376US11810820B2Through electrode substrate, method of manufacturing through electrode substrate, and mounting substrateDAINIPPON PRINTING CO LTD·Filed 2022·Granted Nov 7, 2023·0 cites·15 claims
- 1475US8544169B2Method of manufacturing a through-hole electrode substrateTAKANO TAKAMASA·Filed 2010·Granted Oct 1, 2013·3 cites·8 claims
- 1573US11217530B2Line structure and a method for producing the sameDAINIPPON PRINTING CO LTD·Filed 2020·Granted Jan 4, 2022·0 cites·17 claims
- 1673US11069618B2Line structure and a method for producing the sameDAINIPPON PRINTING CO LTD·Filed 2020·Granted Jul 20, 2021·0 cites·2 claims
- 1772US12394680B2Through electrode substrate, manufacturing method thereof and mounting substrateDAINIPPON PRINTING CO LTD·Filed 2021·Granted Aug 19, 2025·0 cites·14 claims
- 1872US12119293B2Through electrode substrate and mounting substrateDAINIPPON PRINTING CO LTD·Filed 2021·Granted Oct 15, 2024·0 cites·15 claims
- 1971US11373906B2Through electrode substrate, method of manufacturing through electrode substrate, and mounting substrateDAINIPPON PRINTING CO LTD·Filed 2021·Granted Jun 28, 2022·0 cites·12 claims
- 2071US10014244B2Through-hole electrode substrateDAINIPPON PRINTING CO LTD·Filed 2016·Granted Jul 3, 2018·1 cites·14 claims
- 2171US8198726B2Through-hole electrode substrate and method of manufacturing the sameNAKAYAMA KOICHI·Filed 2009·Granted Jun 12, 2012·4 cites·10 claims
- 2269US11742273B2Through electrode substrate and semiconductor deviceDAINIPPON PRINTING CO LTD·Filed 2021·Granted Aug 29, 2023·0 cites·15 claims
- 2360US10950533B2Through electrode substrate and semiconductor deviceDAINIPPON PRINTING CO LTD·Filed 2019·Granted Mar 16, 2021·0 cites·26 claims
- 2458US10600728B2Through-hole electrode substrateDAINIPPON PRINTING CO LTD·Filed 2018·Granted Mar 24, 2020·0 cites·14 claims
- 2556US9443788B2Through-hole electrode substrateDAINIPPON PRINTING CO LTD·Filed 2013·Granted Sep 13, 2016·0 cites·9 claims
- 2654US2019259696A1Through electrode substrate and mounting substrateDAINIPPON PRINTING CO LTD·Filed 2017·Application pending·0 cites
- 2752US2024096808A1Semiconductor package, manufacturing method of semiconductor package, and interposer groupDAINIPPON PRINTING CO LTD·Filed 2022·Application pending·0 cites
- 2849US11430730B2Wiring substrate and semiconductor deviceDAINIPPON PRINTING CO LTD·Filed 2020·Granted Aug 30, 2022·0 cites·26 claims
- 2949US8623751B2Through-hole electrode substrate and method of manufacturing the sameNAKAYAMA KOICHI·Filed 2012·Granted Jan 7, 2014·0 cites·10 claims
- 3047US10712453B2Detection elementDAINIPPON PRINTING CO LTD·Filed 2018·Granted Jul 14, 2020·0 cites·12 claims
- 3144US9209319B2Sensor device manufacturing method and sensor deviceDAINIPPON PRINTING CO LTD·Filed 2012·Granted Dec 8, 2015·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →