Inventor
HURTUBISE RICHARD
US25 patents
⚠️ This page may combine multiple inventors who share the name “HURTUBISE RICHARD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ENTHONE
18 patentsUS7670950B2Mar 2, 2010
Copper metallization of through silicon via
ENTHONE43 citations92
US7410899B2Aug 12, 2008
Defectivity and process control of electroless deposition in microelectronics applications
ENTHONE21 citations91
US7316772B2Jan 8, 2008
Defect reduction in electrodeposited copper for semiconductor applications
ENTHONE23 citations91
US7303992B2Dec 4, 2007
Copper electrodeposition in microelectronics
ENTHONE29 citations91
US8771495B2Jul 8, 2014
Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers
ENTHONE8 citations84
US7998859B2Aug 16, 2011
Surface preparation process for damascene copper deposition
ENTHONE16 citations84
US7968455B2Jun 28, 2011
Copper deposition for filling features in manufacture of microelectronic devices
ENTHONE11 citations84
US7393781B2Jul 1, 2008
Capping of metal interconnects in integrated circuit electronic devices
ENTHONE10 citations84
US7332193B2Feb 19, 2008
Cobalt and nickel electroless plating in microelectronic devices
ENTHONE16 citations83
US7268074B2Sep 11, 2007
Capping of metal interconnects in integrated circuit electronic devices
ENTHONE9 citations73
US7815786B2Oct 19, 2010
Copper electrodeposition in microelectronics
ENTHONE6 citations72
US7615491B2Nov 10, 2009
Defectivity and process control of electroless deposition in microelectronics applications
ENTHONE4 citations72
US7611988B2Nov 3, 2009
Defectivity and process control of electroless deposition in microelectronics applications
ENTHONE7 citations72
US7611987B2Nov 3, 2009
Defectivity and process control of electroless deposition in microelectronics applications
ENTHONE6 citations72
US8002962B2Aug 23, 2011
Copper electrodeposition in microelectronics
ENTHONE3 citations61
US9613858B2Apr 4, 2017
Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers
ENTHONE0 citations52
US9493884B2Nov 15, 2016
Copper electrodeposition in microelectronics
ENTHONE0 citations51
US7704306B2Apr 27, 2010
Manufacture of electroless cobalt deposition compositions for microelectronics applications
ENTHONE1 citations51
MACDERMID ENTHONE INC
3 patentsUS11697884B2Jul 11, 2023
Copper deposition in wafer level packaging of integrated circuits
MACDERMID ENTHONE INC0 citations61
USRE49202ESep 6, 2022
Copper electrodeposition in microelectronics
MACDERMID ENTHONE INC0 citations61
US11124888B2Sep 21, 2021
Copper deposition in wafer level packaging of integrated circuits
MACDERMID ENTHONE INC0 citations61