Inventor
HIRAMATSU RYO
JP8 patents
⚠️ This page may combine multiple inventors who share the name “HIRAMATSU RYO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
YAZAKI CORP
4 patentsUS12090934B2Sep 17, 2024
Connecting method and electrical component unit
YAZAKI CORP2 citations70
US11057978B2Jul 6, 2021
Lighting control system and lighting control method
YAZAKI CORP1 citations59
US10988066B2Apr 27, 2021
Communication system, vehicle unit, and seat unit
YAZAKI CORP0 citations59
US10976993B2Apr 13, 2021
Audio control system and audio control method
YAZAKI CORP0 citations59
SANDISK TECHNOLOGIES LLC
2 patentsUS10790296B1Sep 29, 2020
Distortion-compensated wafer bonding method and apparatus using a temperature-controlled backside thermal expansion layer
SANDISK TECHNOLOGIES LLC19 citations93
US10797035B1Oct 6, 2020
Bonded assembly containing side bonding structures and methods of manufacturing the same
SANDISK TECHNOLOGIES LLC16 citations84