Inventor · disambiguated record
Bi-Ming Yen
Also filed as: YEN BI-MING
31 granted patents·4 pending applications·582 citations·filing 2001–2025
96Inventor score
Files withLAM RES CORP14TAIWAN SEMICONDUCTOR MFG CO LTD13TAIWAN SEMICONDUCTOR MFG3CHO SANGJUN2DHINDSA RAJINDER1
Top patents by PatentIndex Score
35 records- 0198US8652298B2Triode reactor design with multiple radiofrequency powersDHINDSA RAJINDER·Filed 2011·Granted Feb 18, 2014·160 cites·20 claims
- 0298US6527911B1Configurable plasma volume etch chamberLAM RES CORP·Filed 2001·Granted Mar 4, 2003·218 cites·31 claims
- 0393US7307025B1Lag controlLAM RES CORP·Filed 2005·Granted Dec 11, 2007·26 cites·15 claims
- 0491US7169231B2Gas distribution system with tuning gasLAM RES CORP·Filed 2002·Granted Jan 30, 2007·47 cites·13 claims
- 0586US7371332B2Uniform etch systemLAM RES CORP·Filed 2003·Granted May 13, 2008·29 cites·11 claims
- 0685US11764081B2Wafer cleaning apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 19, 2023·1 cites·20 claims
- 0785US11056358B2Wafer cleaning apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 6, 2021·3 cites·19 claims
- 0885US9159581B2Method of making a semiconductor device using a bottom antireflective coating (BARC) layerTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Oct 13, 2015·6 cites·20 claims
- 0984US6930048B1Etching a metal hard mask for an integrated circuit structureLAM RES CORP·Filed 2002·Granted Aug 16, 2005·43 cites·32 claims
- 1081US12165887B2Wafer cleaning apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 1181US2025062140A1Wafer cleaning apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1276US9159580B2Method of making a semiconductor device using multiple layer setsTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Oct 13, 2015·3 cites·20 claims
- 1376US2025385096A1Wet bench process with in-situ pre-treatment operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1474US7789991B1Lag controlLAM RES CORP·Filed 2007·Granted Sep 7, 2010·4 cites·6 claims
- 1572US9176388B2Multi-line width pattern created using photolithographyTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 3, 2015·2 cites·19 claims
- 1671US8283255B2In-situ photoresist strip during plasma etching of active hard maskCHO SANGJUN·Filed 2007·Granted Oct 9, 2012·4 cites·18 claims
- 1771US7442114B2Methods for silicon electrode assembly etch rate and etch uniformity recoveryLAM RES CORP·Filed 2004·Granted Oct 28, 2008·14 cites·19 claims
- 1867US12347692B2Wet bench process with in-situ pre-treatment operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 1, 2025·0 cites·19 claims
- 1967US8236188B2Method for low-K dielectric etch with reduced damageJI BING·Filed 2010·Granted Aug 7, 2012·2 cites·18 claims
- 2067US7951616B2Process for wafer temperature verification in etch toolsLAM RES CORP·Filed 2009·Granted May 31, 2011·2 cites·16 claims
- 2164US11495684B2Method of removing an etch maskTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 8, 2022·0 cites·20 claims
- 2263US8801892B2Uniform etch systemLARSON DEAN J·Filed 2008·Granted Aug 12, 2014·1 cites·7 claims
- 2362US7078350B2Methods for the optimization of substrate etching in a plasma processing systemLAM RES CORP·Filed 2004·Granted Jul 18, 2006·11 cites·35 claims
- 2459US7041230B2Method for selectively etching organosilicate glass with respect to a doped silicon carbideLAM RES CORP·Filed 2003·Granted May 9, 2006·0 cites·9 claims
- 2559US6979579B1Methods and apparatus for inspecting contact openings in a plasma processing systemLAM RES CORP·Filed 2004·Granted Dec 27, 2005·6 cites·40 claims
- 2657US10636908B2Method of removing an etch maskTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 28, 2020·0 cites·20 claims
- 2754US10553720B2Method of removing an etch maskTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Feb 4, 2020·0 cites·20 claims
- 2854US2007128849A1Waferless automatic cleaning after barrier removalLAM RES CORP·Filed 2007·Application pending·0 cites
- 2952US9733570B2Multi-line width pattern created using photolithographyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 15, 2017·0 cites·20 claims
- 3051US9601333B2Etching processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Mar 21, 2017·0 cites·20 claims
- 3151US9589798B2Method of making a semiconductor device using a barrier and antireflective coating (BARC) layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Mar 7, 2017·0 cites·20 claims
- 3249US9455156B2Method of making a semiconductor device using multiple layer setsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 27, 2016·0 cites·20 claims
- 3345US8912633B2In-situ photoresist strip during plasma etching of active hard maskCHO SANGJUN·Filed 2012·Granted Dec 16, 2014·0 cites·20 claims
- 3438US2004112540A1Uniform etch systemLAM RES CORP·Filed 2003·Application pending·0 cites
- 3531US7211518B2Waferless automatic cleaning after barrier removalLAM RES CORP·Filed 2004·Granted May 1, 2007·0 cites·12 claims
Join the waitlist — get patent alerts
Get an alert when Bi-Ming Yen files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →