Inventor
TSAI YU-PENG
TW38 patents
⚠️ This page may combine multiple inventors who share the name “TSAI YU-PENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
22 patentsUS9768048B2Sep 19, 2017
Package on-package structure
TAIWAN SEMICONDUCTOR MFG CO LTD26 citations94
US10868353B2Dec 15, 2020
Electronic device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9859229B2Jan 2, 2018
Package structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD16 citations84
US9559005B2Jan 31, 2017
Methods of packaging and dicing semiconductor devices and structures thereof
TAIWAN SEMICONDUCTOR MFG CO LTD14 citations84
US11482491B2Oct 25, 2022
Package structure with porous conductive structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10622240B2Apr 14, 2020
Package on-package structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10535644B1Jan 14, 2020
Manufacturing method of package on package structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9627369B2Apr 18, 2017
Packages and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US12581977B2Mar 17, 2026
Bonding through multi-shot laser reflow
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12040309B2Jul 16, 2024
Bonding through multi-shot laser reflow
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11996400B2May 28, 2024
Manufacturing method of package on package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11830781B2Nov 28, 2023
Package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11532498B2Dec 20, 2022
Package-on-package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11462507B2Oct 4, 2022
Bonding through multi-shot laser reflow
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11342321B2May 24, 2022
Manufacturing method of package on package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11239103B2Feb 1, 2022
Package-on-package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10790261B2Sep 29, 2020
Bonding through multi-shot laser reflow
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10134703B2Nov 20, 2018
Package on-package process for applying molding compound
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9754908B2Sep 5, 2017
Wafer with liquid molding compound and post-passivation interconnect
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9698028B2Jul 4, 2017
Semiconductor package and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9679790B2Jun 13, 2017
Singulation apparatus and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9431360B2Aug 30, 2016
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
TAIWAN SEMICONDUCTOR MFG
9 patentsUS9196559B2Nov 24, 2015
Directly sawing wafers covered with liquid molding compound
TAIWAN SEMICONDUCTOR MFG61 citations98
US9269687B2Feb 23, 2016
Packaging methods and packaged semiconductor devices
TAIWAN SEMICONDUCTOR MFG7 citations84
US9385040B2Jul 5, 2016
Method of manufacturing a semiconductor device
TAIWAN SEMICONDUCTOR MFG5 citations73
US9331023B1May 3, 2016
Device packaging
TAIWAN SEMICONDUCTOR MFG3 citations73
US9082636B2Jul 14, 2015
Packaging methods and structures for semiconductor devices
TAIWAN SEMICONDUCTOR MFG4 citations73
US8853002B2Oct 7, 2014
Methods for metal bump die assembly
TAIWAN SEMICONDUCTOR MFG2 citations62
US9257321B2Feb 9, 2016
Singulation apparatus and method
TAIWAN SEMICONDUCTOR MFG0 citations52
US9073158B2Jul 7, 2015
Methods for forming 3DIC package
TAIWAN SEMICONDUCTOR MFG0 citations52
US8987058B2Mar 24, 2015
Method for wafer separation
TAIWAN SEMICONDUCTOR MFG0 citations52