Inventor
KANG GYUHO
KR13 patents
Patents
13 patentsUS11676887B2Jun 13, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD8 citations84
US11742271B2Aug 29, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD4 citations72
US12218039B2Feb 4, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US12119306B2Oct 15, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US12027482B2Jul 2, 2024
Semiconductor chip having a through electrode and semiconductor package including the semiconductor chip
SAMSUNG ELECTRONICS CO LTD0 citations61
US11682630B2Jun 20, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US12381151B2Aug 5, 2025
Semiconductor device and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US11664312B2May 30, 2023
Semiconductor device and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US12575437B2Mar 10, 2026
Redistribution substrate, semiconductor package including the same, and method of fabricating redistribution substrate
SAMSUNG ELECTRONICS CO LTD0 citations58
US12381130B2Aug 5, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50
US12183664B2Dec 31, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50
US12119331B2Oct 15, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50
US12107063B2Oct 1, 2024
Semiconductor package device
SAMSUNG ELECTRONICS CO LTD0 citations50