Inventor
SU CHUNG-HUI
TW19 patents
Patents
19 patentsUS5677557AOct 14, 1997
Method for forming buried plug contacts on semiconductor integrated circuits
TAIWAN SEMICONDUCTOR MFG61 citations96
US5480814AJan 2, 1996
Process of making a polysilicon barrier layer in a self-aligned contact module
TAIWAN SEMICONDUCTOR MFG70 citations95
US6093617AJul 25, 2000
Process to fabricate hemispherical grain polysilicon
TAIWAN SEMICONDUCTOR MFG23 citations92
US5796135AAug 18, 1998
Process to fabricate stacked capacitor dram and low power thin film transistor sram devices on a single semiconductor chip
TAIWAN SEMICONDUCTOR MFG20 citations92
US5716881AFeb 10, 1998
Process to fabricate stacked capacitor DRAM and low power thin film transistor SRAM devices on a single semiconductor chip
TAIWAN SEMICONDUCTOR MFG32 citations92
US5607879AMar 4, 1997
Method for forming buried plug contacts on semiconductor integrated circuits
TAIWAN SEMICONDUCTOR MFG40 citations92
US5587696ADec 24, 1996
High resistance polysilicon resistor for integrated circuits and method of fabrication thereof
TAIWAN SEMICONDUCTOR MFG28 citations92
US5576243ANov 19, 1996
Process for forming stacked contacts and metal contacts on static random access memory having thin film transistors
TAIWAN SEMICONDUCTOR MFG19 citations92
US5547892AAug 20, 1996
Process for forming stacked contacts and metal contacts on static random access memory having thin film transistors
TAIWAN SEMICONDUCTOR MFG35 citations92
US5545584AAug 13, 1996
Unified contact plug process for static random access memory (SRAM) having thin film transistors
TAIWAN SEMICONDUCTOR MFG53 citations92
US5545585AAug 13, 1996
Method of making a dram circuit with fin-shaped stacked capacitors
TAIWAN SEMICONDUCTOR MFG42 citations92
US6222214B1Apr 24, 2001
Plug structure and process for forming stacked contacts and metal contacts on static random access memory thin film transistors
TAIWAN SEMICONDUCTOR MFG8 citations74
US6001731ADec 14, 1999
Isolation dielectric deposition in multi-polysilicon chemical-mechanical polishing process
TAIWAN SEMICONDUCTOR MFG10 citations74
US5867087AFeb 2, 1999
Three dimensional polysilicon resistor for integrated circuits
TAIWAN SEMICONDUCTOR MFG15 citations74
US5668380ASep 16, 1997
Reduced area metal contact to a thin polysilicon layer contact structure having low ohmic resistance
TAIWAN SEMICONDUCTOR MFG9 citations74
US5652174AJul 29, 1997
Unified stacked contact process for static random access memory (SRAM) having polysilicon load resistors
TAIWAN SEMICONDUCTOR MFG15 citations74
US5837582ANov 17, 1998
Method to increase capacitance of a DRAM cell
TAIWAN SEMICONDUCTOR MFG15 citations73
US6218286B1Apr 17, 2001
Isolation dielectric deposition in multi-polysilicon chemical-mechanical polishing process
TAIWAN SEMICONDUCTOR MFG4 citations63
US5534451AJul 9, 1996
Method for fabricating a reduced area metal contact to a thin polysilicon layer contact structure having low ohmic resistance
TAIWAN SEMICONDUCTOR MFG3 citations63