Inventor

IM SEUNGWON

KR43 patents

⚠️ This page may combine multiple inventors who share the name “IM SEUNGWON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IM SEUNGWON

SEMICONDUCTOR COMPONENTS IND LLC

Stray inductance reduction in packaged semiconductor devices and modules

Semiconductor device package assemblies with direct leadframe attachment

Package including multiple semiconductor devices

Power module package and method of manufacturing the same

Heat transfer for power modules

Semiconductor packages using package in package systems and related methods

Semiconductor package and related methods

Stray inductance reduction in packaged semiconductor devices

Semiconductor package having junction cooling pipes embedded in substrates

Integration of semiconductor device assemblies with thermal dissipation mechanisms

Semiconductor device package assemblies with direct leadframe attachment

Package including multiple semiconductor devices

Package including multiple semiconductor devices

Semiconductor die package including a one-body clip

Power module package

Package including multiple semiconductor devices

Semiconductor packages using package in package systems and related methods

High power module package structures

Submodule semiconductor package

Integration of semiconductor device assemblies with thermal dissipation mechanisms

Clips for semiconductor package and related methods

Power module package

Power module package

Power module package

Dual cool power module with stress buffer layer

Immersion direct cooling modules

Power module and related methods

Dual cool power module with stress buffer layer

Power module and related methods

Power module package with stacked direct bonded metal substrates

Integrated circuit direct cooling systems having substrates in contact with a cooling medium

Semiconductor package having a spacer with a junction cooling pipe

Transfer molded power modules and methods of manufacture

Thermal mismatch reduction in semiconductor device modules

Semiconductor device modules

Switching oscillation reduction for power semiconductor device modules

Current sharing mismatch reduction in power semiconductor device modules

Semiconductor device package assemblies and methods of manufacture

FAIRCHILD SEMICONDUCTOR

Semiconductor package and related methods

Semiconductor package and related methods

FAIRCHILD KR SEMICONDUCTOR LTD

Power module having stacked flip-chip and method for fabricating the power module

IM SEUNGWON

Power device packages having thermal electric modules using peltier effect and methods of fabricating the same

FAIRCHILD KOREA SEMICONDUCTOR LTD

Semiconductor die package and manufacturing method