Inventor
JENG SHWANGMING
TW14 patents
Patents
14 patentsUS6358839B1Mar 19, 2002
Solution to black diamond film delamination problem
TAIWAN SEMICONDUCTOR MFG53 citations96
US6483173B2Nov 19, 2002
Solution to black diamond film delamination problem
TAIWAN SEMICONDUCTOR MFG40 citations92
US6451701B1Sep 17, 2002
Method for making low-resistance silicide contacts between closely spaced electrically conducting lines for field effect transistors
TAIWAN SEMICONDUCTOR MFG22 citations92
US6268294B1Jul 31, 2001
Method of protecting a low-K dielectric material
TAIWAN SEMICONDUCTOR MFG32 citations92
US6258715B1Jul 10, 2001
Process for low-k dielectric with dummy plugs
TAIWAN SEMICONDUCTOR MFG45 citations92
US6251777B1Jun 26, 2001
Thermal annealing method for forming metal silicide layer
TAIWAN SEMICONDUCTOR MFG42 citations92
US6143673ANov 7, 2000
Method for forming gap filling silicon oxide intermetal dielectric (IMD) layer formed employing ozone-tEOS
TAIWAN SEMICONDUCTOR MFG21 citations92
US6457477B1Oct 1, 2002
Method of cleaning a copper/porous low-k dual damascene etch
TAIWAN SEMICONDUCTOR MFG31 citations89
US6277658B1Aug 21, 2001
Method for monitoring alignment mark shielding
TAIWAN SEMICONDUCTOR MFG20 citations84
US6242356B1Jun 5, 2001
Etchback method for forming microelectronic layer with enhanced surface smoothness
TAIWAN SEMICONDUCTOR MFG17 citations84
US6207483B1Mar 27, 2001
Method for smoothing polysilicon gate structures in CMOS devices
TAIWAN SEMICONDUCTOR MFG12 citations74
US6121111ASep 19, 2000
Method of removing tungsten near the wafer edge after CMP
TAIWAN SEMICONDUCTOR MFG14 citations74
US6080638AJun 27, 2000
Formation of thin spacer at corner of shallow trench isolation (STI)
TAIWAN SEMICONDUCTOR MFG13 citations70
US6328815B1Dec 11, 2001
Multiple chamber vacuum processing system configuration for improving the stability of mark shielding process
TAIWAN SEMICONDUCTOR MFG6 citations61