Inventor

YOON SEUNG-UK

KR31 patents

⚠️ This page may combine multiple inventors who share the name “YOON SEUNG-UK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YOON SEUNG-UK

ELECTRONICS & TELECOMMUNICATIONS RES INST

Camera auxiliary device for privacy protection and privacy protection method using the same

Apparatus and method for creating three-dimensional personalized figure

Apparatus and method for generating 3D printing model using multiple textures

Device and method for generating dynamic texture map for 3 dimensional digital human

Learning-based 3D model creation apparatus and method

Apparatus and method for guiding multi-view capture

Learning-based 3D model creation apparatus and method

Method and system for generating 3D image of character

Method and apparatus for reconstructing 3D face with stereo camera

STATS CHIPPAC LTD

Semiconductor device and method of forming different height conductive pillars to electrically interconnect stacked laterally offset semiconductor die

Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect

Semiconductor device and method of forming different height conductive pillars to electrically interconnect stacked laterally offset semiconductor die

Integrated circuit packaging system with embedded circuitry and post, and method of manufacture thereof

Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect

Integrated circuit packaging system having through silicon vias with partial depth metal fill regions and method of manufacture thereof

Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect

Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die

PAGAILA REZA A

Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die

Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier

Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die

JCET SEMICONDUCTOR SHAOXING CO LTD

Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect

Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect

Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die

AGENCY SCIENCE TECH & RES

RF and MMIC stackable micro-modules

RF and MMIC stackable micro-modules

YOON SEUNG-UK

Apparatus and method for creating 3D content for oriental painting

SHIM IL KWON

Integrated circuit packaging system with embedded circuitry and post

LIM SEONG-JAE

3D model shape transformation method and apparatus

KOREA ELECTRONICS TELECOMM

Apparatus and method for reconstructing three dimensional faces based on multiple cameras

KIM KAP KEE

Local multi-resolution 3-D face-inherent model generation apparatus and method and facial skin management system

HWANG BON WOO

System and method for managing face data