Inventor
CHEN CHIA-YIN
TW14 patents
⚠️ This page may combine multiple inventors who share the name “CHEN CHIA-YIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
9 patentsUS9449898B2Sep 20, 2016
Semiconductor device having backside interconnect structure through substrate via and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations83
US10269611B1Apr 23, 2019
Method and apparatus for bonding semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations81
US11056419B2Jul 6, 2021
Semiconductor device having backside interconnect structure on through substrate via and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US10510641B2Dec 17, 2019
Semiconductor device having backside interconnect structure on through substrate via and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US12322680B2Jun 3, 2025
Semiconductor device having backside interconnect structure on through substrate via
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11823979B2Nov 21, 2023
Method of forming semiconductor device having backside interconnect structure on through substrate via
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11948920B2Apr 2, 2024
Semiconductor device and method for manufacturing the same, and semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US10867831B1Dec 15, 2020
Method and apparatus for bonding semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations49
US10748803B2Aug 18, 2020
Method and apparatus for bonding semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations49