Inventor
YU KUO-HUA
TW19 patents
⚠️ This page may combine multiple inventors who share the name “YU KUO-HUA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SILICONWARE PRECISION INDUSTRIES CO LTD
17 patentsUS10510720B2Dec 17, 2019
Electronic package and method for fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD5 citations72
US10756438B2Aug 25, 2020
Electronic package and method for fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations70
US12400931B2Aug 26, 2025
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations62
US12278189B2Apr 15, 2025
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations62
US12080618B2Sep 3, 2024
Electronic package, heat dissipation structure and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations62
US11810862B2Nov 7, 2023
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations62
US11605554B2Mar 14, 2023
Flip-chip process and bonding equipment
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations62
US11521930B2Dec 6, 2022
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations62
US10950520B2Mar 16, 2021
Electronic package, method for fabricating the same, and heat dissipator
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations60
US11101566B2Aug 24, 2021
Method for fabricating electronic package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations59
US11289794B2Mar 29, 2022
Electronic package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations56
US12132003B2Oct 29, 2024
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations53
US11984379B2May 14, 2024
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations52
US10763237B2Sep 1, 2020
Method for manufacturing electronic package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations47
US10522500B2Dec 31, 2019
Method for manufacturing electronic package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations47
US11380978B2Jul 5, 2022
Electronic package and method for fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations46
US12387993B2Aug 12, 2025
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations39