Inventor
ISLAM MOHAMMED RABIUL
US17 patents
⚠️ This page may combine multiple inventors who share the name “ISLAM MOHAMMED RABIUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
11 patentsUS11808977B2Nov 7, 2023
Structures and methods for high speed interconnection in photonic systems
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11215753B2Jan 4, 2022
Photonic semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US12265258B2Apr 1, 2025
Structures and methods for high speed interconnection in photonic systems
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12092862B2Sep 17, 2024
Photonic semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12046580B2Jul 23, 2024
Three-dimensional integrated circuit (3D IC) low-dropout (LDO) regulator power delivery
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11703639B2Jul 18, 2023
Photonic semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11550102B2Jan 10, 2023
Structures and methods for high speed interconnection in photonic systems
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12223247B2Feb 11, 2025
Logic cell structures and related methods
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US11816412B2Nov 14, 2023
Logic cell structures and related methods
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US11966090B2Apr 23, 2024
Heterogeneous packaging integration of photonic and electronic elements
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations57
US12181724B2Dec 31, 2024
Apparatus and methods for optical interconnects
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations48
MOTOROLA INC
6 patentsUS6326301B1Dec 4, 2001
Method for forming a dual inlaid copper interconnect structure
MOTOROLA INC83 citations97
US6444569B2Sep 3, 2002
Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process
MOTOROLA INC60 citations95
US6274478B1Aug 14, 2001
Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process
MOTOROLA INC70 citations95
US6551919B2Apr 22, 2003
Method for forming a dual inlaid copper interconnect structure
MOTOROLA INC23 citations92
US6297155B1Oct 2, 2001
Method for forming a copper layer over a semiconductor wafer
MOTOROLA INC132 citations92
US6573173B2Jun 3, 2003
Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process
MOTOROLA INC23 citations91