Inventor

LIN WEI-HUNG

TW169 patents

⚠️ This page may combine multiple inventors who share the name “LIN WEI-HUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN WEI-HUNG

TAIWAN SEMICONDUCTOR MFG CO LTD

Package structure and method for forming the same

Package structures and methods for forming the same

Alignment in the packaging of integrated circuits

Package structure and method for forming the same

Semiconductor packaging structure and method

Package on package structure and method for forming the same

Methods of packaging and dicing semiconductor devices and structures thereof

Substrate and package structure

Warpage control in package-on-package structures

Chip structure and method for forming the same

Package structure

Method of manufacturing semiconductor structure

Package on package structure and method for forming the same

Semiconductor structure and method for forming the same

Packaged semiconductor devices and methods of packaging semiconductor devices

Method for manufacturing package structure

Method of manufacturing wafer level chip scale package

Packaged semiconductor devices and methods of packaging semiconductor devices

Package on package structure and method for forming the same

Warpage control in package-on-package structures

Package structure and method for forming the same

Packaged semiconductor devices and methods of packaging semiconductor devices

Semiconductor processing boat design with pressure sensor

Package-on-package structures and methods for forming the same

Semiconductor package structure and method of manufacturing the same

Packaged semiconductor devices and methods of packaging semiconductor devices

Substrate and package structure

Warpage control in package-on-package structures

TAIWAN SEMICONDUCTOR MFG

Thermal compress bonding

Package on package bonding structure and method for forming the same

Alignment in the packaging of integrated circuits

Packaging methods and packaged semiconductor devices

Packaging methods and packaged semiconductor devices

Packaged semiconductor devices and methods of packaging semiconductor devices

Package on package bonding structure and method for forming the same

PHISON ELECTRONICS CORP

Data storage apparatus

Storage device

Flash memory disk with rotatable and telescopic protection structure and method using the same

Method of manufacturing storage apparatus

LIN WEI-HUNG

Storage apparatus and method of manufacturing the same

Luminous ball

CHEN MENG-TSE

Package-on-package structure having polymer-based material for warpage control

Process for forming packages

LIN CHIH-WEI

Packaging methods and structures for semiconductor devices

SPEED TECH CORP

Coaxial cable connecting apparatus

LIN CHUN-CHENG

Semiconductor packaging structure and method

YU CHEN-HUA

Package on package structures and methods for forming the same

BLACKSTAR CORP

Luminous ball

PHOENIX PREC TECHNOLOGY CORP

Method for manufacturing coreless packaging substrate

CHEN MENG TSE

Bump-on-trace packaging structure and method for forming the same