Inventor · disambiguated record
Siew S. Hiew
Also filed as: HIEW SIEW S · HIEW SIEW SIN
27 granted patents·14 pending applications·849 citations·filing 2005–2011
97Inventor score
Top patents by PatentIndex Score
41 records- 0198US7872873B2Extended COB-USB with dual-personality contactsSUPER TALENT ELECTRONICS INC·Filed 2008·Granted Jan 18, 2011·75 cites·18 claims
- 0297US8102657B2Single shot molding method for COB USB/EUSB devices with contact pad ribsHIEW SIEW S·Filed 2008·Granted Jan 24, 2012·60 cites·14 claims
- 0397US7877542B2High integration of intelligent non-volatile memory deviceSUPER TALENT ELECTRONICS INC·Filed 2008·Granted Jan 25, 2011·71 cites·17 claims
- 0497US7466556B2Single chip USB packages with swivel coverSUPER TALENT ELECTRONICS INC·Filed 2007·Granted Dec 16, 2008·68 cites·20 claims
- 0596US7535719B2Single chip USB packages with contact-pins coverSUPER TALENT ELECTRONICS INC·Filed 2007·Granted May 19, 2009·51 cites·20 claims
- 0696US7440286B2Extended USB dual-personality card readerSUPER TALENT ELECTRONICS INC·Filed 2007·Granted Oct 21, 2008·65 cites·16 claims
- 0795US8567050B2Single shot molding method for COB USB/EUSB devices with contact pad ribsHIEW SIEW S·Filed 2011·Granted Oct 29, 2013·20 cites·8 claims
- 0895US8141240B2Manufacturing method for micro-SD flash memory cardHIEW SIEW S·Filed 2007·Granted Mar 27, 2012·38 cites·8 claims
- 0995US7869218B2Light-weight solid state drive with rivet setsSUPER TALENT ELECTRONICS INC·Filed 2008·Granted Jan 11, 2011·41 cites·16 claims
- 1095US7517231B2Solid state drive (SSD) with open top and bottom coversSUPER TALENT ELECTRONICS INC·Filed 2007·Granted Apr 14, 2009·58 cites·2 claims
- 1194US8102658B2Micro-SD to secure digital adaptor card and manufacturing methodHIEW SIEW S·Filed 2009·Granted Jan 24, 2012·33 cites·22 claims
- 1294US7517252B2Thin solid state drive housing structuresSUPER TALENT ELECTRONICS INC·Filed 2007·Granted Apr 14, 2009·32 cites·14 claims
- 1393US7447037B2Single chip USB packages by various assembly methodsSUPER TALENT ELECTRONICS INC·Filed 2007·Granted Nov 4, 2008·28 cites·20 claims
- 1492US8254134B2Molded memory card with write protection switch assemblyHIEW SIEW S·Filed 2010·Granted Aug 28, 2012·16 cites·21 claims
- 1592US7830666B2Manufacturing process for single-chip MMC/SD flash memory device with molded asymmetric circuit boardSUPER TALENT ELECTRONICS INC·Filed 2007·Granted Nov 9, 2010·24 cites·17 claims
- 1691US8102662B2USB package with bistable sliding mechanismHIEW SIEW S·Filed 2009·Granted Jan 24, 2012·25 cites·14 claims
- 1790US7878852B2Single chip universal serial bus (USB) package with metal housingSUPERTALENT ELECTRONICS INC·Filed 2007·Granted Feb 1, 2011·23 cites·19 claims
- 1888US7687921B2High density memory device manufacturing using isolated step padsSUPER TALENT ELECTRONICS INC·Filed 2008·Granted Mar 30, 2010·17 cites·19 claims
- 1988US7547218B2Plug and cap for a universal-serial-bus (USB) deviceSUPER TALENT ELECTRONICS INC·Filed 2007·Granted Jun 16, 2009·29 cites·17 claims
- 2086US7789680B2USB device with connected capSUPER TALENT ELECTRONICS INC·Filed 2009·Granted Sep 7, 2010·11 cites·14 claims
- 2185US7804163B2Seamless secured digital card manufacturing methods with male guide and female switchSUPERTALENT ELECTRONICS INC·Filed 2007·Granted Sep 28, 2010·13 cites·14 claims
- 2284US7872871B2Molding methods to manufacture single-chip chip-on-board USB deviceSUPER TALENT ELECTRONICS INC·Filed 2007·Granted Jan 18, 2011·12 cites·29 claims
- 2384US7795714B2Two step molding process secured digital card manufacturing method and apparatusSUPERTALENT ELECTRONICS INC·Filed 2007·Granted Sep 14, 2010·12 cites·17 claims
- 2482US7874067B1Manufacturing method for single chip COB USB devices with optional embedded LEDSUPER TALENT ELECTRONICS INC·Filed 2008·Granted Jan 25, 2011·10 cites·3 claims
- 2580US8240034B1High throughput manufacturing method for micro flash memory cardsHIEW SIEW S·Filed 2008·Granted Aug 14, 2012·9 cites·9 claims
- 2667US7802155B2Non-volatile memory device manufacturing process testing systems and methods thereofSUPER TALENT ELECTRONICS INC·Filed 2008·Granted Sep 21, 2010·6 cites·9 claims
- 2763US7866562B2Fixed write-protect seamless memory cardSUPERTALENT ELECTRONICS INC·Filed 2007·Granted Jan 11, 2011·2 cites·39 claims
- 2856US2010248512A1USB Device With Connected CapSUPER TALENT ELECTRONICS INC·Filed 2010·Application pending·0 cites
- 2954US2009100295A1Reliable memory module testing and manufacturing methodSUPER TALENT ELECTRONICS INC·Filed 2008·Application pending·0 cites
- 3051US2008235939A1Manufacturing Method For Micro-SD Flash Memory CardSUPER TALENT ELECTRONICS INC·Filed 2008·Application pending·0 cites
- 3151US2009190277A1ESD Protection For USB Memory DevicesSUPER TALENT ELECTRONICS INC·Filed 2009·Application pending·0 cites
- 3248US2009097215A1Uv-epoxy and ultrasonic case assembly methods for usb flash driveHIEW SIEW S·Filed 2007·Application pending·0 cites
- 3348US2008041966A1Mid-Seam Package Methods of Manufacture for Memory Cards Using Ultraviolet Cure Adhesive and Ultra-Sonic PressSUPER TALENT ELECTRONICS INC·Filed 2007·Application pending·0 cites
- 3447US2008185694A1Processes of Manufacturing Portable Electronic Storage Devices Utilizing Lead Frame ConnectorsSUPER TALENT ELECTRONICS INC·Filed 2007·Application pending·0 cites
- 3546US2008195817A1SD Flash Memory Card Manufacturing Using Rigid-Flex PCBSUPER TALENT ELECTRONICS INC·Filed 2008·Application pending·0 cites
- 3646US2008286990A1Direct Package Mold Process For Single Chip SD Flash CardsSUPER TALENT ELECTRONICS INC·Filed 2008·Application pending·0 cites
- 3746US2009194616A1Sporoderm-Broken Polypore ProductionSUPER TALENT ELECTRONICS INC·Filed 2008·Application pending·0 cites
- 3845US2009086448A1Solid state drive with coverless casingHIEW SIEW S·Filed 2007·Application pending·0 cites
- 3945US2008191030A1Single Side Package Memory CardSUPER TALENT ELECTRONICS INC·Filed 2007·Application pending·0 cites
- 4043US2008032561A1Slim memory card with retractable protection shieldSUPER TALENT ELECTRONICS INC·Filed 2007·Application pending·0 cites
- 4141US2007120213A1Wire under dam package and method for packaging image-sensorHIEW SIEW S·Filed 2005·Application pending·0 cites
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