Inventor
VARGHESE SONY
US54 patents
⚠️ This page may combine multiple inventors who share the name “VARGHESE SONY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
25 patentsUS11152373B1Oct 19, 2021
Structures and methods for forming dynamic random-access devices
APPLIED MATERIALS INC6 citations84
US11380691B1Jul 5, 2022
CMOS over array of 3-D DRAM device
APPLIED MATERIALS INC3 citations73
US10607847B1Mar 31, 2020
Gate all around device and method of formation using angled ions
APPLIED MATERIALS INC4 citations73
US11749564B2Sep 5, 2023
Techniques for void-free material depositions
APPLIED MATERIALS INC2 citations70
US10930735B2Feb 23, 2021
Gate all around device and method of formation using angled ions
APPLIED MATERIALS INC0 citations63
US12581637B2Mar 17, 2026
Methods and structures for three-dimensional dynamic random-access memory
APPLIED MATERIALS INC0 citations62
US12482749B2Nov 25, 2025
L-type wordline connection structure for three-dimensional memory
APPLIED MATERIALS INC0 citations62
US11980021B2May 7, 2024
CMOS over array of 3-D DRAM device
APPLIED MATERIALS INC0 citations62
US11700721B2Jul 11, 2023
Structures and methods for forming dynamic random-access devices
APPLIED MATERIALS INC0 citations62
US11569242B2Jan 31, 2023
DRAM memory device having angled structures with sidewalls extending over bitlines
APPLIED MATERIALS INC0 citations62
US11557515B2Jan 17, 2023
Methods for sub-lithography resolution patterning
APPLIED MATERIALS INC0 citations62
US11037788B2Jun 15, 2021
Integration of device regions
APPLIED MATERIALS INC0 citations62
US11018138B2May 25, 2021
Methods for forming dynamic random-access devices by implanting a drain through a spacer opening at the bottom of angled structures
APPLIED MATERIALS INC0 citations62
US12354973B2Jul 8, 2025
Stress and overlay management for semiconductor processing
APPLIED MATERIALS INC0 citations61
US10903211B1Jan 26, 2021
Gate devices and methods of formation using angled ions
APPLIED MATERIALS INC0 citations61
US12131948B2Oct 29, 2024
Techniques for void-free material depositions
APPLIED MATERIALS INC0 citations60
US12217974B2Feb 4, 2025
Localized stress modulation by implant to back of wafer
APPLIED MATERIALS INC0 citations59
US11956978B2Apr 9, 2024
Techniques and device structure based upon directional seeding and selective deposition
APPLIED MATERIALS INC1 citations59
US11404314B2Aug 2, 2022
Metal line patterning
APPLIED MATERIALS INC0 citations59
US12477723B2Nov 18, 2025
Three dimensional memory device and method of fabrication
APPLIED MATERIALS INC0 citations52
US10580651B2Mar 3, 2020
Integration of device regions
APPLIED MATERIALS INC0 citations52
US10692775B2Jun 23, 2020
Fin damage reduction during punch through implantation of FinFET device
APPLIED MATERIALS INC0 citations51
US10686033B2Jun 16, 2020
Fin damage reduction during punch through implantation of FinFET device
APPLIED MATERIALS INC0 citations51
US11974423B2Apr 30, 2024
Replacement channel process for three-dimensional dynamic random access memory
APPLIED MATERIALS INC0 citations50
US12464702B2Nov 4, 2025
Three-dimensional dynamic random-access memory (3D DRAM) gate all-around (GAA) design using stacked Si/SiGe
APPLIED MATERIALS INC0 citations49
VARIAN SEMICONDUCTOR EQUIPMENT ASS INC
15 patentsUS10403738B1Sep 3, 2019
Techniques for improved spacer in nanosheet device
VARIAN SEMICONDUCTOR EQUIPMENT ASS INC11 citations84
US10403552B1Sep 3, 2019
Replacement gate formation with angled etch and deposition
VARIAN SEMICONDUCTOR EQUIPMENT ASS INC7 citations83
US10811304B2Oct 20, 2020
Increased isolation of diffusion breaks in FinFET devices using an angled etch
VARIAN SEMICONDUCTOR EQUIPMENT ASS INC3 citations73
US10685865B2Jun 16, 2020
Method and device for power rail in a fin type field effect transistor
VARIAN SEMICONDUCTOR EQUIPMENT ASS INC5 citations73
US11462546B2Oct 4, 2022
Dynamic random access device including two-dimensional array of fin structures
VARIAN SEMICONDUCTOR EQUIPMENT ASS INC3 citations70
US11532483B2Dec 20, 2022
Spacer sculpting for forming semiconductor devices
VARIAN SEMICONDUCTOR EQUIPMENT ASS INC0 citations62
US11217491B2Jan 4, 2022
Replacement gate formation with angled etch and deposition
VARIAN SEMICONDUCTOR EQUIPMENT ASS INC0 citations62
US10971403B2Apr 6, 2021
Structure and method of forming fin device having improved fin liner
VARIAN SEMICONDUCTOR EQUIPMENT ASS INC0 citations62
US10903082B2Jan 26, 2021
Spacer sculpting for forming semiconductor devices
VARIAN SEMICONDUCTOR EQUIPMENT ASS INC0 citations62
US10510610B2Dec 17, 2019
Structure and method of forming fin device having improved fin liner
VARIAN SEMICONDUCTOR EQUIPMENT ASS INC1 citations62
US10886279B2Jan 5, 2021
Device structure for forming semiconductor device having angled contacts
VARIAN SEMICONDUCTOR EQUIPMENT ASS INC0 citations61
US10692872B2Jun 23, 2020
Device structure for forming semiconductor device having angled contacts
VARIAN SEMICONDUCTOR EQUIPMENT ASS INC1 citations61
US10607999B2Mar 31, 2020
Techniques and structure for forming dynamic random access device
VARIAN SEMICONDUCTOR EQUIPMENT ASS INC1 citations59
US11101183B2Aug 24, 2021
Gate spacer formation for scaled CMOS devices
VARIAN SEMICONDUCTOR EQUIPMENT ASS INC0 citations52
US10644117B2May 5, 2020
Techniques for contact formation in self-aligned replacement gate device
VARIAN SEMICONDUCTOR EQUIPMENT ASS INC0 citations52
MICRON TECHNOLOGY INC
10 patentsUS9865578B2Jan 9, 2018
Methods of manufacturing multi-die semiconductor device packages and related assemblies
MICRON TECHNOLOGY INC4 citations84
US10103134B2Oct 16, 2018
Methods of manufacturing multi-die semiconductor device packages and related assemblies
MICRON TECHNOLOGY INC2 citations73
US9412706B1Aug 9, 2016
Engineered carrier wafers
MICRON TECHNOLOGY INC3 citations64
US12020979B2Jun 25, 2024
Methods of forming material within openings extending into a semiconductor construction, and semiconductor constructions having fluorocarbon material
MICRON TECHNOLOGY INC0 citations62
US11515198B2Nov 29, 2022
Semiconductor constructions comprising dielectric material, and methods of forming dielectric fill within openings extending into semiconductor constructions
MICRON TECHNOLOGY INC0 citations62
US10998221B2May 4, 2021
Semiconductor constructions having fluorocarbon material
MICRON TECHNOLOGY INC0 citations62
US10763155B2Sep 1, 2020
Semiconductor constructions comprising dielectric material, and methods of forming dielectric fill within openings extending into semiconductor constructions
MICRON TECHNOLOGY INC0 citations52
US10615069B2Apr 7, 2020
Semiconductor structures comprising polymeric materials
MICRON TECHNOLOGY INC0 citations52
US10153195B1Dec 11, 2018
Semiconductor constructions comprising dielectric material
MICRON TECHNOLOGY INC0 citations52
US9761474B2Sep 12, 2017
Methods for processing semiconductor devices
MICRON TECHNOLOGY INC0 citations52
Showing the top 50 of 54 patents by PatentIndex Score.