Inventor
RAMPLEY Colby Greg
US6 patents
Patents
6 patentsUS10741446B2Aug 11, 2020
Method of wafer dicing for wafers with backside metallization and packaged dies
NXP USA INC2 citations71
US10340251B2Jul 2, 2019
Method for making an electronic component package
NXP USA INC3 citations69
US11437276B2Sep 6, 2022
Packaged dies with metal outer layers extending from die back sides toward die front sides
NXP USA INC0 citations61
US10998231B2May 4, 2021
Method for increasing semiconductor device wafer strength
NXP USA INC1 citations56
US12362294B2Jul 15, 2025
Wafer with semiconductor devices and integrated electrostatic discharge protection
NXP USA INC0 citations48
US11387373B2Jul 12, 2022
Low drain-source on resistance semiconductor component and method of fabrication
NXP USA INC0 citations48