Inventor
HU CHING-HSIANG
TW17 patents
Patents
17 patentsUS11454820B2Sep 27, 2022
Multifunctional collimator for contact image sensors
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations82
US11407636B2Aug 9, 2022
Inter-poly connection for parasitic capacitor and die size improvement
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US11305980B2Apr 19, 2022
Anti-stiction process for MEMS device
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US10513432B2Dec 24, 2019
Anti-stiction process for MEMS device
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10155656B2Dec 18, 2018
Inter-poly connection for parasitic capacitor and die size improvement
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations72
US9884758B2Feb 6, 2018
Selective nitride outgassing process for MEMS cavity pressure control
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11782284B2Oct 10, 2023
Multifunctional collimator for contact image sensors
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US11726342B2Aug 15, 2023
Multifunctional collimator for contact image sensors
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations71
US11448891B2Sep 20, 2022
Multifunctional collimator for contact image sensors
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations71
US12583740B2Mar 24, 2026
Inter-poly connection for parasitic capacitor and die size improvement
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12157667B2Dec 3, 2024
Anti-stiction process for MEMS device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12271006B2Apr 8, 2025
Multifunctional collimator for contact image sensors
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12054382B2Aug 6, 2024
Roughness selectivity for MEMS movement stiction reduction
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11655138B2May 23, 2023
Roughness selectivity for MEMS movement stiction reduction
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12092839B2Sep 17, 2024
Multifunctional collimator for contact image sensors
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12283568B2Apr 22, 2025
Wafer bonding alignment
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US11742320B2Aug 29, 2023
Wafer bonding alignment
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59