Inventor

VELEZ MARIO FRANCISCO

US93 patents

⚠️ This page may combine multiple inventors who share the name “VELEZ MARIO FRANCISCO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

VELEZ MARIO FRANCISCO

QUALCOMM INC

Density-optimized module-level inductor ground structure

Varying thickness inductor

Antenna-on-package arrangements

Three-dimensional high quality passive structure with conductive pillar technology

Compartment shielding in flip-chip (FC) module

Passive-on-glass (POG) device and method

Radio-frequency (RF) shielding in fan-out wafer level package (FOWLP)

Hybrid transformer structure on semiconductor devices

High pass filters and low pass filters using through glass via technology

Low package parasitic inductance using a thru-substrate interposer

Package on package (PoP) integrated device comprising a capacitor in a substrate

Two-stage power delivery architecture

High aspect ratio interconnects in air gap of antenna package

Inductor with metal-insulator-metal (MIM) capacitor

Power management integrated circuit (PMIC) integration into a processor package

Diplexer design using through glass via technology

Glass-based antenna array package

Substrate comprising an embedded inductor and a thin film magnetic core

Interposer device including at least one transistor and at least one through-substrate via

Backside ground plane for integrated circuit

Encapsulation of acoustic resonator devices

Nested through glass via transformer

Augmented capacitor structure for high quality (Q)-factor radio frequency (RF) applications

Thin film magnet inductor structure for high quality (Q)-factor radio frequency (RF) applications

Multiplexer design using a 2D passive on glass filter integrated with a 3D through glass via filter

Passive device assembly for accurate ground plane control

MIM capacitor and method of making the same

Substrate comprising stacks of interconnects, interconnect on solder resist layer and interconnect on side portion of substrate

Varactor device with backside contact

3D pillar inductor

Stress compensation patterning

Superposed structure 3D orthogonal through substrate inductor

Fingerprint sensor device and methods thereof

Close proximity tunable inductive elements

Frequency multiplexer

Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods

Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods

Integration of through glass via (TGV) filter and acoustic filter

Wideband filter with resonators and inductors

Wideband filter with resonators and inductors

Hybrid passive-on-glass (POG) acoustic filter

3D pillar inductor

Integrated device comprising a capacitor and inductor structure comprising a shared interconnect for a capacitor and an inductor

Stacked substrate inductor

QUALCOMM MEMS TECHNOLOGIES INC

Incorporation of passives and fine pitch through via for package on package

ZUO CHENGJIE

Cross-sectional dilation mode resonators

LO CHI SHUN

Complex passive design with special via implementation

BLACK JUSTIN PHELPS

Integrated passives and power amplifier

SWEENEY FIFIN

Thermal vias in an integrated circuit package with an embedded die

SHAH MILIND P

Microelectromechanical systems embedded in a substrate