P

Inventor

SONG YUN HEUB

KR37 patents
⚠️ This page may combine multiple inventors who share the name “SONG YUN HEUB”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

27 patents
US7045413B2May 16, 2006

Method of manufacturing a semiconductor integrated circuit using a selective disposable spacer technique and semiconductor integrated circuit manufactured thereby

SAMSUNG ELECTRONICS CO LTD30 citations92
US6635532B2Oct 21, 2003

Method for fabricating NOR type flash memory device

SAMSUNG ELECTRONICS CO LTD36 citations92
US6507522B2Jan 14, 2003

Method for erasing memory cells in a nonvolatile memory

SAMSUNG ELECTRONICS CO LTD22 citations92
US6791196B2Sep 14, 2004

Semiconductor devices with bonding pads having intermetal dielectric layer of hybrid configuration and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD15 citations83
US7436017B2Oct 14, 2008

Semiconductor integrated circuit using a selective disposable spacer

SAMSUNG ELECTRONICS CO LTD7 citations74
US10892366B2Jan 12, 2021

Thin film transistor and vertical non-volatile memory device including transition metal-induced polycrystalline metal oxide channel layer

SAMSUNG ELECTRONICS CO LTD1 citations71
US7588979B2Sep 15, 2009

Method of manufacturing a semiconductor integrated circuit using a selective disposable spacer technique and semiconductor integrated circuit manufactured thereby

SAMSUNG ELECTRONICS CO LTD1 citations63
US12238928B2Feb 25, 2025

Three-dimensional flash memory with reduced wire length and manufacturing method therefor

SAMSUNG ELECTRONICS CO LTD0 citations62
US12232430B2Feb 18, 2025

Switching device having bi-directional drive characteristics and method of operating same

SAMSUNG ELECTRONICS CO LTD0 citations62
US12067478B2Aug 20, 2024

PCM-based neural network device

SAMSUNG ELECTRONICS CO LTD0 citations62
US11988702B2May 21, 2024

Method and system for inspection of defective MTJ cell in STT-MRAM

SAMSUNG ELECTRONICS CO LTD0 citations62
US11980109B2May 7, 2024

Selection element-integrated phase-change memory and method for producing same

SAMSUNG ELECTRONICS CO LTD0 citations62
US11955177B2Apr 9, 2024

Three-dimensional flash memory including middle metallization layer and manufacturing method thereof

SAMSUNG ELECTRONICS CO LTD0 citations62
US11812661B2Nov 7, 2023

Phase-change memory device having reversed phase-change characteristics and phase-change memory having highly integrated three-dimensional architecture using same

SAMSUNG ELECTRONICS CO LTD0 citations62
US11581327B2Feb 14, 2023

Three-dimensional flash memory with reduced wire length and manufacturing method therefor

SAMSUNG ELECTRONICS CO LTD0 citations62
US11544538B2Jan 3, 2023

Pulse driving apparatus for minimising asymmetry with respect to weight in synapse element, and method therefor

SAMSUNG ELECTRONICS CO LTD0 citations62
US11195996B2Dec 7, 2021

Phase-change memory device having reversed phase-change characteristics and phase-change memory having highly integrated three-dimensional architecture using same

SAMSUNG ELECTRONICS CO LTD0 citations62
US11037954B2Jun 15, 2021

Three dimensional flash memory element with middle source-drain line and manufacturing method thereof

SAMSUNG ELECTRONICS CO LTD0 citations62
US7928501B2Apr 19, 2011

Semiconductor device and methods of forming and operating the same

SAMSUNG ELECTRONICS CO LTD2 citations62
US12211940B2Jan 28, 2025

Thin film transistor and vertical non-volatile memory device including transition metal-induced polycrystalline metal oxide channel layer

SAMSUNG ELECTRONICS CO LTD0 citations61
US11942553B2Mar 26, 2024

Method for fabricating a semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations61
US11882705B2Jan 23, 2024

Three-dimensional semiconductor memory device, operating method of the same and electronic system including the same

SAMSUNG ELECTRONICS CO LTD1 citations59
US12520497B2Jan 6, 2026

Three-dimensional flash memory using ferroelectric layer on basis of back gate structure

SAMSUNG ELECTRONICS CO LTD0 citations52
US12374411B2Jul 29, 2025

Three-dimensional flash memory for improving integration and operation method thereof

SAMSUNG ELECTRONICS CO LTD0 citations52
US12082417B2Sep 3, 2024

3-dimensional flash memory having air gap, and method for manufacturing same

SAMSUNG ELECTRONICS CO LTD0 citations52
US11616081B2Mar 28, 2023

Three-dimensional semiconductor memory device including ferroelectric thin film and manufacturing method of the same

SAMSUNG ELECTRONICS CO LTD0 citations52
US8354708B2Jan 15, 2013

Methods of forming and operating semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations52

IUCF HYU

4 patents

UNIV HANYANG IND UNIV COOP FOUND

3 patents

INTELLECTUAL DISCOVERY CO LTD

1 patent

SONG YUN HEUB

1 patent

LEE SANG-EUN

1 patent