Inventor
SONG YUN HEUB
KR37 patents
⚠️ This page may combine multiple inventors who share the name “SONG YUN HEUB”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
27 patentsUS7045413B2May 16, 2006
Method of manufacturing a semiconductor integrated circuit using a selective disposable spacer technique and semiconductor integrated circuit manufactured thereby
SAMSUNG ELECTRONICS CO LTD30 citations92
US6635532B2Oct 21, 2003
Method for fabricating NOR type flash memory device
SAMSUNG ELECTRONICS CO LTD36 citations92
US6507522B2Jan 14, 2003
Method for erasing memory cells in a nonvolatile memory
SAMSUNG ELECTRONICS CO LTD22 citations92
US6791196B2Sep 14, 2004
Semiconductor devices with bonding pads having intermetal dielectric layer of hybrid configuration and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD15 citations83
US7436017B2Oct 14, 2008
Semiconductor integrated circuit using a selective disposable spacer
SAMSUNG ELECTRONICS CO LTD7 citations74
US10892366B2Jan 12, 2021
Thin film transistor and vertical non-volatile memory device including transition metal-induced polycrystalline metal oxide channel layer
SAMSUNG ELECTRONICS CO LTD1 citations71
US7588979B2Sep 15, 2009
Method of manufacturing a semiconductor integrated circuit using a selective disposable spacer technique and semiconductor integrated circuit manufactured thereby
SAMSUNG ELECTRONICS CO LTD1 citations63
US12238928B2Feb 25, 2025
Three-dimensional flash memory with reduced wire length and manufacturing method therefor
SAMSUNG ELECTRONICS CO LTD0 citations62
US12232430B2Feb 18, 2025
Switching device having bi-directional drive characteristics and method of operating same
SAMSUNG ELECTRONICS CO LTD0 citations62
US12067478B2Aug 20, 2024
PCM-based neural network device
SAMSUNG ELECTRONICS CO LTD0 citations62
US11988702B2May 21, 2024
Method and system for inspection of defective MTJ cell in STT-MRAM
SAMSUNG ELECTRONICS CO LTD0 citations62
US11980109B2May 7, 2024
Selection element-integrated phase-change memory and method for producing same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11955177B2Apr 9, 2024
Three-dimensional flash memory including middle metallization layer and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD0 citations62
US11812661B2Nov 7, 2023
Phase-change memory device having reversed phase-change characteristics and phase-change memory having highly integrated three-dimensional architecture using same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11581327B2Feb 14, 2023
Three-dimensional flash memory with reduced wire length and manufacturing method therefor
SAMSUNG ELECTRONICS CO LTD0 citations62
US11544538B2Jan 3, 2023
Pulse driving apparatus for minimising asymmetry with respect to weight in synapse element, and method therefor
SAMSUNG ELECTRONICS CO LTD0 citations62
US11195996B2Dec 7, 2021
Phase-change memory device having reversed phase-change characteristics and phase-change memory having highly integrated three-dimensional architecture using same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11037954B2Jun 15, 2021
Three dimensional flash memory element with middle source-drain line and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD0 citations62
US7928501B2Apr 19, 2011
Semiconductor device and methods of forming and operating the same
SAMSUNG ELECTRONICS CO LTD2 citations62
US12211940B2Jan 28, 2025
Thin film transistor and vertical non-volatile memory device including transition metal-induced polycrystalline metal oxide channel layer
SAMSUNG ELECTRONICS CO LTD0 citations61
US11942553B2Mar 26, 2024
Method for fabricating a semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations61
US11882705B2Jan 23, 2024
Three-dimensional semiconductor memory device, operating method of the same and electronic system including the same
SAMSUNG ELECTRONICS CO LTD1 citations59
US12520497B2Jan 6, 2026
Three-dimensional flash memory using ferroelectric layer on basis of back gate structure
SAMSUNG ELECTRONICS CO LTD0 citations52
US12374411B2Jul 29, 2025
Three-dimensional flash memory for improving integration and operation method thereof
SAMSUNG ELECTRONICS CO LTD0 citations52
US12082417B2Sep 3, 2024
3-dimensional flash memory having air gap, and method for manufacturing same
SAMSUNG ELECTRONICS CO LTD0 citations52
US11616081B2Mar 28, 2023
Three-dimensional semiconductor memory device including ferroelectric thin film and manufacturing method of the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US8354708B2Jan 15, 2013
Methods of forming and operating semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations52
IUCF HYU
4 patentsUS12588221B2Mar 24, 2026
Three-dimensional flash memory with high degree of integration
IUCF HYU0 citations62
US11688462B2Jun 27, 2023
Three-dimensional flash memory with back gate
IUCF HYU1 citations56
US11515333B2Nov 29, 2022
Ferroelectric material-based three-dimensional flash memory, and manufacture thereof
IUCF HYU0 citations56
US12475951B2Nov 18, 2025
Method for operating three-dimensional flash memory
IUCF HYU0 citations47
UNIV HANYANG IND UNIV COOP FOUND
3 patentsUS9922990B2Mar 20, 2018
Three dimensional flash memory using electrode layers and/or interlayer insulation layers having different properties, and preparation method therefor
UNIV HANYANG IND UNIV COOP FOUND13 citations84
US11456319B2Sep 27, 2022
Three-dimensional semiconductor memory device, operating method of the same and electronic system including the same
UNIV HANYANG IND UNIV COOP FOUND1 citations59
US10014348B2Jul 3, 2018
Artificial neuron semiconductor element having three-dimensional structure and artificial neuron semiconductor system using same
UNIV HANYANG IND UNIV COOP FOUND0 citations52