Inventor

CHEN SHIH-HUNG

TW169 patents

⚠️ This page may combine multiple inventors who share the name “CHEN SHIH-HUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEN SHIH-HUNG

MACRONIX INT CO LTD

Phase change memory device and manufacturing method

Thin film fuse phase change RAM and manufacturing method

Thin film plate phase change ram circuit and manufacturing method

Method for making multilayer connection structure

Memory device, manufacturing method and operating method of the same

Phase change memory cell and manufacturing method

Thin film plate phase change RAM circuit and manufacturing method

Single-mask phase change memory element

Contact structure and forming method

Interlayer conductor and method for forming

I-shaped phase change memory cell

Side wall active pin memory and manufacturing method

Thin film fuse phase change RAM and manufacturing method

Self-aligned structure and method for confining a melting point in a resistor random access memory

Three-dimensional semiconductor device and method for forming the same

3D NAND array with sides having undulating shapes

Memory device comprising memory strings penetrating through a stacking structure and electrically contacting with a metal layer and method for fabricating the same

Three-dimensional semiconductor device and method of manufacturing the same

3D NAND memory with decoder and local word line drivers

3D NAND memory device and operation thereof

Three dimensional stacking memory film structure

Word line repair for 3D vertical channel memory

Parallelogram cell design for high speed vertical channel 3D NAND memory

Three-dimensional semiconductor device

3D stacked IC device with stepped substack interlayer connectors

3D stacking semiconductor device and manufacturing method thereof

Three-dimensional multiple chip packages including multiple chip stacks

Three-dimensional semiconductor device

Contact structure and forming method

Memory device structure with page buffers in a page-buffer level separate from the array level

CHEN SHIH-HUNG

Memory architecture of 3D array with alternating memory string orientation and string select structures

Method for forming interlayer connectors to a stack of conductive layers

Buried silicide structure and method for making

Method for creating a 3D stacked multichip module

Reduced number of masks for IC device with stacked contact levels

Thermal protect PCRAM structure and methods for making

Memory with off-chip controller

Integrated circuit capacitor and method

Damascene word line

Loadport bridge for semiconductor fabrication tools

Structure of ECC spare bits in 3D memory

Integrated circuit pattern and method

Semiconductor structure with improved capacitance of bit line

Contact architecture for 3D memory array

LUE HANG-TING

Integration of 3D stacked IC device with peripheral circuits

Memory device, manufacturing method and operating method of the same

IND TECH RES INST

Initial-on SCR device for on-chip ESD protection

Circuit for electrostatic discharge (ESD) protection

LUNG HSIANG LAN

Method for manufacturing a phase change memory device with pillar bottom electrode

SHIH YEN-HAO

Method for forming interlayer connectors in a three-dimensional stacked IC device