Inventor
MIYASHITA HIROHITO
JP22 patents
⚠️ This page may combine multiple inventors who share the name “MIYASHITA HIROHITO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NIPPON MINING CO
6 patentsUS7507304B2Mar 24, 2009
Copper alloy sputtering target and semiconductor element wiring
NIPPON MINING CO23 citations92
US4666667AMay 19, 1987
High-strength, high-conductivity copper alloy
NIPPON MINING CO32 citations90
US7618505B2Nov 17, 2009
Target of high-purity nickel or nickel alloy and its producing method
NIPPON MINING CO11 citations84
US7138040B2Nov 21, 2006
Electrolytic copper plating method, phosphorous copper anode for electrolytic plating method, and semiconductor wafer having low particle adhesion plated with said method and anode
NIPPON MINING CO12 citations82
US7740718B2Jun 22, 2010
Target of high-purity nickel or nickel alloy and its producing method
NIPPON MINING CO7 citations73
US7459036B2Dec 2, 2008
Hafnium alloy target and process for producing the same
NIPPON MINING CO5 citations73
NIKKO MATERIALS CO LTD
6 patentsUS6858116B2Feb 22, 2005
Sputtering target producing few particles, backing plate or sputtering apparatus and sputtering method producing few particles
NIKKO MATERIALS CO LTD41 citations92
US6793124B1Sep 21, 2004
Diffusion-joined target assemly of high-purity cobalt target and copper alloy backing plate and production method therefor
NIKKO MATERIALS CO LTD30 citations92
US6759143B2Jul 6, 2004
Tantalum or tungsten target-copper alloy backing plate assembly and production method therefor
NIKKO MATERIALS CO LTD39 citations92
US6723183B2Apr 20, 2004
Silicide target for depositing less embrittling gate oxide and method of manufacturing silicide target
NIKKO MATERIALS CO LTD32 citations92
US6582535B1Jun 24, 2003
Tungsten target for sputtering and method for preparing thereof
NIKKO MATERIALS CO LTD34 citations92
US6875325B2Apr 5, 2005
Sputtering target producing few particles
NIKKO MATERIALS CO LTD11 citations74
OKABE TAKEO
6 patentsUS8246764B2Aug 21, 2012
Copper alloy sputtering target and semiconductor element wiring
OKABE TAKEO10 citations83
US9472383B2Oct 18, 2016
Copper or copper alloy target/copper alloy backing plate assembly
OKABE TAKEO3 citations72
US8262816B2Sep 11, 2012
Hafnium alloy target
OKABE TAKEO3 citations62
US8241438B2Aug 14, 2012
Hafnium alloy target
OKABE TAKEO3 citations62
US8062440B2Nov 22, 2011
Hafnium alloy target and process for producing the same
OKABE TAKEO3 citations62
US9896745B2Feb 20, 2018
Copper alloy sputtering target and method for manufacturing the target
OKABE TAKEO1 citations51