Inventor

GOMES WILFRED

US75 patents

⚠️ This page may combine multiple inventors who share the name “GOMES WILFRED”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GOMES WILFRED

INTEL CORP

Transistors with back-side contacts to create three dimensional memory and logic

Three-dimensional nanoribbon-based dynamic random-access memory

Three-dimensional nanoribbon-based static random-access memory

Three-dimensional nanoribbon-based logic

Thin film transistor based memory cells on both sides of a layer of logic devices

Dense memory arrays utilizing access transistors with back-side contacts

Hyperchip

Integrated circuit assemblies

Integrated three-dimensional (3D) DRAM cache

Distributed semiconductor die and package architecture

Hyperchip

Device, method and system for providing a stacked arrangement of integrated circuit dies

Three-dimensional memory arrays with layer selector transistors

Integrated circuit assemblies with direct chip attach to circuit boards

Device, system and method for providing inductor structures

Rlink—die to die channel interconnect configurations to improve signaling

Distributed semiconductor die and package architecture

Die interconnection scheme for providing a high yielding process for high performance microprocessors

Back-side power delivery with glass support at the front

Vertically stacked and bonded memory arrays

Digital to analog converter using high-injection velocity channel materials for low temperature signal conversion

Memory with one access transistor for multiple hysteretic capacitors

Integrated planar transistors and memory cell array architectures

Cooling approaches for stitched dies

Bilayer memory stacking with computer logic circuits shared between bottom and top memory layers

Stacked backend memory with resistive switching devices

Multi-layered optical integrated circuit assembly with a monocrystalline waveguide and lower crystallinity bonding layer

Hybrid manufacturing for integrating photonic and electronic components

Device, method and system for providing a stacked arrangement of integrated circuit dies

Method and apparatus to implement an integrated circuit including both dynamic random-access memory (DRAM) and static random-access memory (SRAM)

Two transistor memory cells with angled transistors

Integrated circuit interconnect structures with a metal chalcogenide liner

Embedded dynamic random-access memory (eDRAM) to operate based on data access characteristics

Integrated circuit devices with angled transistors formed based on angled wafers

Integrated circuit structures having ultra-high conductivity global routing

Hyperchip

Embedded memory IC&#39;s with power supply droop circuitry coupled to ferroelectric capacitors

Decoupling capacitors and methods of fabrication

Hybrid manufacturing for integrated circuit devices and assemblies

Three-dimensional memory arrays with layer selector transistors

Hyperchip

Three-dimensional nanoribbon-based dynamic random-access memory

Hyperchip

Microelectronic package with three-dimensional (3D) monolithic memory die

Hybrid manufacturing for integrated circuit devices and assemblies

Thin film transistor based memory cells on both sides of a layer of logic devices

Bridge hub tiling architecture

Providing orthogonal subarrays in a dynamic random access memory

Field-effect transistor with hybrid switching mechanism

GOMES WILFRED

Distributed semiconductor die and package architecture

Embedded memory IC's with power supply droop circuitry coupled to ferroelectric capacitors