Inventor

CHUNG HYUNSOO

KR41 patents

⚠️ This page may combine multiple inventors who share the name “CHUNG HYUNSOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHUNG HYUNSOO

SAMSUNG ELECTRONICS CO LTD

Semiconductor device and method for manufacturing the same

Semiconductor packages having through electrodes and methods for fabricating the same

Semiconductor package and method of fabricating the same

Semiconductor devices having through-vias and methods for fabricating the same

Semiconductor packages having through electrodes and methods of fabricating the same

Method of fabricating semiconductor package, semiconductor package formed thereby, and semiconductor device including the same

Semiconductor packages having through electrodes and methods of fabricating the same

Semiconductor devices having through-vias and methods for fabricating the same

Semiconductor device and method for manufacturing the same

Semiconductor devices with redistribution pads

Semiconductor package and method of manufacturing the same

Semiconductor package including heat redistribution layers

Semiconductor device and method of fabricating the same

Semiconductor device and method for manufacturing the same

Semiconductor device and method for manufacturing the same

Semiconductor package

Semiconductor package

Semiconductor package and method of manufacturing the same

Semiconductor package with conductive bump on conductive post including an intermetallic compound layer

Semiconductor device and method of fabricating the same

Semiconductor package

Semiconductor devices having through-vias and methods for fabricating the same

Semiconductor device including dummy pad

Semiconductor package including pads

Semiconductor package including sub-package

Semiconductor device

Semiconductor package and method of fabricating the same

Semiconductor device

Semiconductor package

Semiconductor package including through-silicon via and method of forming the same

Semiconductor package, and a package on package type semiconductor package having the same

Semiconductor package with stack structure and method of manufacturing the semiconductor package

Semiconductor package

Semiconductor package

Semiconductor devices having through-electrodes and methods for fabricating the same

LEE HO-JIN

Semiconductor devices having conductive via structures and methods for fabricating the same

Microelectronic devices having conductive through via electrodes insulated by gap regions

Semiconductor devices including protected barrier layers

CREAMO INC

Assembly unit for toy assembly block

Assembly unit for toy assembly block

STORZ KARL GMBH & CO KG

Endoscope sheath, endoscope arrangement, and method for providing an endoscope arrangement