Inventor
LEE YEONG GYU
KR28 patents
⚠️ This page may combine multiple inventors who share the name “LEE YEONG GYU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
23 patentsUS9929716B2Mar 27, 2018
Acoustic resonator and method of manufacturing the same
SAMSUNG ELECTRO MECH27 citations93
US7394139B2Jul 1, 2008
Optical modulator module package using flip-chip mounting technology
SAMSUNG ELECTRO MECH19 citations91
US7227267B2Jun 5, 2007
Semiconductor package using flip-chip mounting technique
SAMSUNG ELECTRO MECH10 citations83
US12184265B2Dec 31, 2024
Resonator package and method of manufacturing the same
SAMSUNG ELECTRO MECH3 citations75
US10715098B2Jul 14, 2020
Acoustic resonator package
SAMSUNG ELECTRO MECH2 citations73
US10263598B2Apr 16, 2019
Acoustic resonator and method of manufacturing the same
SAMSUNG ELECTRO MECH4 citations73
US9787280B2Oct 10, 2017
Acoustic resonator and method of manufacturing the same
SAMSUNG ELECTRO MECH5 citations72
US10367471B2Jul 30, 2019
Resonator package and method of manufacturing the same
SAMSUNG ELECTRO MECH1 citations62
US7098535B2Aug 29, 2006
Semiconductor package and packaging method using flip-chip bonding technology
SAMSUNG ELECTRO MECH5 citations62
US7116456B2Oct 3, 2006
Light modulator module package
SAMSUNG ELECTRO MECH5 citations61
US7078804B2Jul 18, 2006
Micro-electro-mechanical system (MEMS) package with side sealing member and method of manufacturing the same
SAMSUNG ELECTRO MECH6 citations61
US10511281B2Dec 17, 2019
Acoustic wave resonator and filter including the same
SAMSUNG ELECTRO MECH0 citations52
US10790798B2Sep 29, 2020
Acoustic resonator and method for manufacturing the same
SAMSUNG ELECTRO MECH0 citations51
US10329142B2Jun 25, 2019
Wafer level package and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations51
US9998094B2Jun 12, 2018
Bulk acoustic wave resonator having a frame spaced apart from an electrode
SAMSUNG ELECTRO MECH0 citations51
US7388282B2Jun 17, 2008
Micro-electro-mechanical system (MEMS) package having hydrophobic layer
SAMSUNG ELECTRO MECH0 citations51
US6915033B2Jul 5, 2005
Multi-channel optical switch and method for manufacturing the same
SAMSUNG ELECTRO MECH1 citations51
US7343072B2Mar 11, 2008
Light modulator package having inclined light transmissive lid
SAMSUNG ELECTRO MECH1 citations50
US10277196B2Apr 30, 2019
Bulk acoustic wave resonator and method for manufacturing the same
SAMSUNG ELECTRO MECH0 citations48
US10637428B2Apr 28, 2020
Acoustic wave device and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations45
US10069472B2Sep 4, 2018
Bulk acoustic wave resonator and filter including the same
SAMSUNG ELECTRO MECH0 citations42
US7443024B2Oct 28, 2008
Micro-electro-mechanical system (MEMS) package having side double-sealing member and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations41
US10693438B2Jun 23, 2020
Acoustic wave resonator and method for manufacturing the same
SAMSUNG ELECTRO MECH0 citations39
SAMSUNG ELECTRONICS CO LTD
4 patentsUS6012856AJan 11, 2000
Method and article for splicing optical fibers coated with metal and reinforced splice formed thereby
SAMSUNG ELECTRONICS CO LTD22 citations92
US6175675B1Jan 16, 2001
Apparatus for aligning and method of bonding optical waveguide device to optical fiber block
SAMSUNG ELECTRONICS CO LTD37 citations91
US6526199B1Feb 25, 2003
Arrayed waveguide grating wavelength division multiplexer provided with alignment waveguides and apparatus for aligning the same
SAMSUNG ELECTRONICS CO LTD9 citations72
US6278814B1Aug 21, 2001
1×N optical wavelength-division demultiplexer alignment apparatus and 1×N optical wavelength-division demultiplexer therefor
SAMSUNG ELECTRONICS CO LTD9 citations72