Light modulator module package

Abstract

Disclosed herein is a light modulator module package, which is advantageous because a size of the module package is minimized and heat is efficiently dispersed while the optical properties of a light modulator device are maintained.

1. A light modulator module package, comprising:
 a printed circuit board having an inner circuit and a hole to receive an incident beam of light; 
 a light transmissive lid attached to an upper surface of the printed circuit board; 
 a light modulator device formed on the light transmissive lid to correspond to a position of the hole in the printed circuit board so as to modulate the incident beam of light passing through the hole in the printed circuit board to be emitted as diffracted light; 
 one or more drive integrated circuits formed around the light modulator device to supply a driving voltage to the light modulator device, in response to an externally input control signal; 
 a connector formed on one side of the printed circuit board to supply the externally input control signal to the drive integrated circuits; and 
 a molded part to enclose the printed circuit board and the light transmissive lid so as to hold the printed circuit board and the light transmissive lid. 
 
   
   
     2. The module package as set forth in  claim 1 , further comprising a heat spreader formed on the light modulator device and the drive integrated circuits to disperse heat. 
   
   
     3. The module package as set forth in  claim 2 , wherein the light modulator device is formed to be lower than the drive integrated circuits, and the heat spreader has a protrusion corresponding to a height of the light modulator device. 
   
   
     4. The module package as set forth in  claim 2 , wherein the light modulator device is formed to have a same height as the drive integrated circuits, and the heat spreader has a flat adhesion surface to which the light modulator device and the drive integrated circuits adhere.