Inventor · disambiguated record
Jeffrey D. Gelorme
Also filed as: GELORME JEFFREY · GELORME JEFFREY D · GELORME JEFFREY DONALD
112 granted patents·12 pending applications·2,070 citations·filing 1985–2023
99Inventor score
Top patents by PatentIndex Score
124 records- 0198US10217637B1Chip handling and electronic component integrationIBM·Filed 2017·Granted Feb 26, 2019·35 cites·13 claims
- 0297US5370825AWater-soluble electrically conducting polymers, their synthesis and useIBM·Filed 1993·Granted Dec 6, 1994·101 cites·59 claims
- 0395US7219713B2Heterogeneous thermal interface for coolingIBM·Filed 2005·Granted May 22, 2007·38 cites·37 claims
- 0495US4882245APhotoresist composition and printed circuit boards and packages made therewithIBM·Filed 1987·Granted Nov 21, 1989·179 cites·16 claims
- 0594US5278010AComposition for photo imagingIBM·Filed 1992·Granted Jan 11, 1994·49 cites·11 claims
- 0694US5026624AComposition for photo imagingIBM·Filed 1989·Granted Jun 25, 1991·133 cites·26 claims
- 0793US7351360B2Self orienting micro plates of thermally conducting material as component in thermal paste or adhesiveIBM·Filed 2004·Granted Apr 1, 2008·33 cites·15 claims
- 0893US6238599B1High conductivity, high strength, lead-free, low cost, electrically conducting materials and applicationsIBM·Filed 1997·Granted May 29, 2001·90 cites·10 claims
- 0992US7063127B2Method and apparatus for chip-coolingIBM·Filed 2003·Granted Jun 20, 2006·71 cites·27 claims
- 1091US9324601B1Low temperature adhesive resins for wafer bondingIBM·Filed 2014·Granted Apr 26, 2016·8 cites·12 claims
- 1191US5191182ATuneable apparatus for microwave processingIBM·Filed 1991·Granted Mar 2, 1993·81 cites·3 claims
- 1290US5054872APolymeric optical waveguides and methods of forming the sameIBM·Filed 1990·Granted Oct 8, 1991·102 cites·34 claims
- 1390US5047568ASulfonium salts and use and preparation thereofIBM·Filed 1988·Granted Sep 10, 1991·30 cites·12 claims
- 1488US8604623B2Self orienting micro plates of thermally conducting material as component in thermal paste or adhesiveHOUGHAM GARETH·Filed 2012·Granted Dec 10, 2013·4 cites·15 claims
- 1588US5304457AComposition for photo imagingIBM·Filed 1992·Granted Apr 19, 1994·20 cites·14 claims
- 1687US9947570B2Handler bonding and debonding for semiconductor diesIBM·Filed 2016·Granted Apr 17, 2018·3 cites·16 claims
- 1787US7768121B2Apparatus and methods for cooling semiconductor integrated circuit package structuresIBM·Filed 2007·Granted Aug 3, 2010·13 cites·14 claims
- 1887US7452568B2Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formationIBM·Filed 2005·Granted Nov 18, 2008·15 cites·1 claims
- 1986US10658182B2Chip handling and electronic component integrationIBM·Filed 2019·Granted May 19, 2020·1 cites·20 claims
- 2086US5512613ACleavable diepoxide for removable epoxy compositionsIBM·Filed 1994·Granted Apr 30, 1996·77 cites·11 claims
- 2185US6319650B1High resolution crosslinkable photoresist composition, compatable with high base concentration aqueous developers method and for use thereofIBM·Filed 2000·Granted Nov 20, 2001·26 cites·12 claims
- 2285US5645764AElectrically conductive pressure sensitive adhesivesIBM·Filed 1995·Granted Jul 8, 1997·61 cites·29 claims
- 2385US4940651AMethod for patterning cationic curable photoresistIBM·Filed 1988·Granted Jul 10, 1990·56 cites·14 claims
- 2484US10325785B2Handler bonding and debonding for semiconductor diesIBM·Filed 2017·Granted Jun 18, 2019·2 cites·9 claims
- 2583US4615763ARoughening surface of a substrateIBM·Filed 1985·Granted Oct 7, 1986·46 cites·19 claims
- 2682US10224219B2Handler bonding and debonding for semiconductor diesIBM·Filed 2015·Granted Mar 5, 2019·2 cites·14 claims
- 2782US10174229B2Adhesive resins for wafer bondingIBM·Filed 2017·Granted Jan 8, 2019·2 cites·16 claims
- 2882US6030550AMethods of fabrication of cross-linked electrically conductive polymers and precursors thereofIBM·Filed 1996·Granted Feb 29, 2000·41 cites·26 claims
- 2981US10395929B2Chip handling and electronic component integrationIBM·Filed 2017·Granted Aug 27, 2019·2 cites·14 claims
- 3081US5241040AMicrowave processingIBM·Filed 1990·Granted Aug 31, 1993·32 cites·13 claims
- 3180US10607963B2Chip package for two-phase cooling and assembly process thereofIBM·Filed 2016·Granted Mar 31, 2020·3 cites·12 claims
- 3280US9627784B1Method and apparatus for strain relieving surface mount attached connectorsIBM·Filed 2015·Granted Apr 18, 2017·2 cites·10 claims
- 3380US5317081AMicrowave processingIBM·Filed 1991·Granted May 31, 1994·32 cites·28 claims
- 3479US9748131B2Low temperature adhesive resins for wafer bondingIBM·Filed 2015·Granted Aug 29, 2017·2 cites·13 claims
- 3579US6010645AWater-soluble electrically conducting polymers, their synthesis and useIBM·Filed 1994·Granted Jan 4, 2000·24 cites·95 claims
- 3679US5560934ACleavable diepoxide for removable epoxy compositionsIBM·Filed 1995·Granted Oct 1, 1996·51 cites·29 claims
- 3776US10586726B2Handler bonding and debonding for semiconductor diesIBM·Filed 2017·Granted Mar 10, 2020·1 cites·11 claims
- 3875US8268282B2Self orienting micro plates of thermally conducting material as component in thermal paste or adhesiveHOUGHAM GARETH·Filed 2007·Granted Sep 18, 2012·4 cites·12 claims
- 3975US7981849B2Reversible thermal thickening greaseIBM·Filed 2007·Granted Jul 19, 2011·2 cites·15 claims
- 4074US7567090B2Liquid recovery, collection method and apparatus in a non-recirculating test and burn-in applicationIBM·Filed 2006·Granted Jul 28, 2009·9 cites·20 claims
- 4174US6555762B2Electronic package having substrate with electrically conductive through holes filled with polymer and conductive compositionIBM·Filed 1999·Granted Apr 29, 2003·38 cites·3 claims
- 4273US10522406B2IR assisted fan-out wafer level packaging using silicon handlerIBM·Filed 2018·Granted Dec 31, 2019·1 cites·12 claims
- 4373US5721299AElectrically conductive and abrasion/scratch resistant polymeric materials, method of fabrication thereof and uses thereofIBM·Filed 1994·Granted Feb 24, 1998·46 cites·24 claims
- 4472US11121005B2Handler bonding and debonding for semiconductor diesIBM·Filed 2020·Granted Sep 14, 2021·0 cites·20 claims
- 4572US10522383B2Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bondingIBM·Filed 2015·Granted Dec 31, 2019·1 cites·4 claims
- 4672US9947567B2Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bondingIBM·Filed 2015·Granted Apr 17, 2018·1 cites·15 claims
- 4772US5382637ASolid state chain extension polymerization between Lewis acid oligomers and deblocked Lewis basesIBM·Filed 1991·Granted Jan 17, 1995·24 cites·11 claims
- 4872US5102772APhotocurable epoxy composition with sulfonium salt photoinitiatorIBM·Filed 1991·Granted Apr 7, 1992·26 cites·14 claims
- 4971US11424152B2Handler bonding and debonding for semiconductor diesIBM·Filed 2020·Granted Aug 23, 2022·0 cites·6 claims
- 5071US7037638B1High sensitivity crosslinkable photoresist composition, based on soluble, film forming dendrimeric calix[4] arene compositions method and for use thereofIBM·Filed 2000·Granted May 2, 2006·10 cites·13 claims
Showing the top 50 of 124 patent records by PatentIndex Score.
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