Inventor · disambiguated record
Scott List
Also filed as: LIST SCOTT · LIST SCOTT RICHARD
5 granted patents·5 pending applications·262 citations·filing 2003–2012
83Inventor score
Technology areasH10W
Top patents by PatentIndex Score
10 records- 0197US7307005B2Wafer bonding with highly compliant plate having filler material enclosed hollow coreINTEL CORP·Filed 2004·Granted Dec 11, 2007·226 cites·6 claims
- 0293US8421225B2Three-dimensional stacked substrate arrangementsRAMANATHAN SHRIRAM·Filed 2012·Granted Apr 16, 2013·14 cites·8 claims
- 0387US7973407B2Three-dimensional stacked substrate arrangementsINTEL CORP·Filed 2008·Granted Jul 5, 2011·12 cites·12 claims
- 0480US8203208B2Three-dimensional stacked substrate arrangementsRAMANATHAN SHRIRAM·Filed 2011·Granted Jun 19, 2012·4 cites·7 claims
- 0555US7214605B2Deposition of diffusion barrierINTEL CORP·Filed 2003·Granted May 8, 2007·6 cites·8 claims
- 0648US2007287263A1Highly compliant plate for wafer bondingKOBRINSKY MAURO J·Filed 2007·Application pending·0 cites
- 0748US2007284409A1Highly compliant plate for wafer bondingKOBRINSKY MAURO·Filed 2007·Application pending·0 cites
- 0840US2005003650A1Three-dimensional stacked substrate arrangementsFiled 2003·Application pending·0 cites
- 0939US2006003548A1Highly compliant plate for wafer bondingKOBRINSKY MAURO J·Filed 2004·Application pending·0 cites
- 1037US2004262772A1Methods for bonding wafers using a metal interlayerFiled 2003·Application pending·0 cites
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