Inventor
CHANG CHIA-YU
TW23 patents
⚠️ This page may combine multiple inventors who share the name “CHANG CHIA-YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TEXAS INSTRUMENTS INC
6 patentsUS9922908B2Mar 20, 2018
Semiconductor package having a leadframe with multi-level assembly pads
TEXAS INSTRUMENTS INC2 citations72
US11342247B2May 24, 2022
Leadframe with vertically spaced die attach pads
TEXAS INSTRUMENTS INC0 citations62
US10957631B2Mar 23, 2021
Angled die pad of a leadframe for a molded integrated circuit package
TEXAS INSTRUMENTS INC0 citations60
US10600724B2Mar 24, 2020
Leadframe with vertically spaced die attach pads
TEXAS INSTRUMENTS INC0 citations51
US10211132B2Feb 19, 2019
Packaged semiconductor device having multi-level leadframes configured as modules
TEXAS INSTRUMENTS INC0 citations51
US9786582B2Oct 10, 2017
Planar leadframe substrate having a downset below within a die area
TEXAS INSTRUMENTS INC0 citations51