Inventor · disambiguated record
Kiyomi Imagawa
Also filed as: IMAGAWA KIYOMI
2 granted patents·2 pending applications·1 citations·filing 2006–2018
29Inventor score
Top patents by PatentIndex Score
4 records- 0162US8173264B2Resin composition and metal laminate plateKAWAGUCHI MASAO·Filed 2006·Granted May 8, 2012·1 cites·6 claims
- 0237US10988647B2Semiconductor substrate manufacturing method, semiconductor device, and method for manufacturing sameMITSUI CHEMICALS INC·Filed 2018·Granted Apr 27, 2021·0 cites·18 claims
- 0334US2013288120A1Polyimide resin composition and laminate including polyimide resin compositionIIDA KENJI·Filed 2012·Application pending·0 cites
- 0431US2012295085A1Polymide resin composition, adhesive agent and laminate each comprising same, and deviceIIDA KENJI·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →