Inventor
QIAN QIUXIAO
CN15 patents
⚠️ This page may combine multiple inventors who share the name “QIAN QIUXIAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FAIRCHILD SEMICONDUCTOR
9 patentsUS8023279B2Sep 20, 2011
FLMP buck converter with a molded capacitor and a method of the same
FAIRCHILD SEMICONDUCTOR7 citations84
US8018054B2Sep 13, 2011
Semiconductor die package including multiple semiconductor dice
FAIRCHILD SEMICONDUCTOR16 citations84
US7825502B2Nov 2, 2010
Semiconductor die packages having overlapping dice, system using the same, and methods of making the same
FAIRCHILD SEMICONDUCTOR16 citations82
US7768123B2Aug 3, 2010
Stacked dual-die packages, methods of making, and systems incorporating said packages
FAIRCHILD SEMICONDUCTOR9 citations82
US7745244B2Jun 29, 2010
Pin substrate and package
FAIRCHILD SEMICONDUCTOR4 citations62
US7915721B2Mar 29, 2011
Semiconductor die package including IC driver and bridge
FAIRCHILD SEMICONDUCTOR4 citations61
US7829988B2Nov 9, 2010
Stacking quad pre-molded component packages, systems using the same, and methods of making the same
FAIRCHILD SEMICONDUCTOR4 citations61
US7750445B2Jul 6, 2010
Stacked synchronous buck converter
FAIRCHILD SEMICONDUCTOR2 citations59
US8367481B2Feb 5, 2013
Four MOSFET full bridge module
FAIRCHILD SEMICONDUCTOR1 citations45
LIU YONG
6 patentsUS8421204B2Apr 16, 2013
Embedded semiconductor power modules and packages
LIU YONG7 citations84
US8138585B2Mar 20, 2012
Four mosfet full bridge module
LIU YONG12 citations78
US8389338B2Mar 5, 2013
Embedded die package on package (POP) with pre-molded leadframe
LIU YONG2 citations62
US8063474B2Nov 22, 2011
Embedded die package on package (POP) with pre-molded leadframe
LIU YONG4 citations62
US8674490B2Mar 18, 2014
Semiconductor die package including IC driver and bridge
LIU YONG2 citations61
US8063472B2Nov 22, 2011
Semiconductor package with stacked dice for a buck converter
LIU YONG2 citations59