Inventor · disambiguated record
Wenjing Liang
Also filed as: LIANG WENJING
4 granted patents·2 pending applications·4 citations·filing 2021–2024
65Inventor score
Technology areasH10W
Files withAEVA INC6
Top patents by PatentIndex Score
6 records- 0193US11362485B1Techniques for bonding multiple semiconductor lasersAEVA INC·Filed 2021·Granted Jun 14, 2022·2 cites·20 claims
- 0292US11789221B2Techniques for device cooling in an optical sub-assemblyAEVA INC·Filed 2021·Granted Oct 17, 2023·2 cites·18 claims
- 0381US2025273925A1System and apparatus for sequential transient liquid phase bondingAEVA INC·Filed 2024·Application pending·0 cites
- 0478US12113331B2System and apparatus for sequential transient liquid phase bondingAEVA INC·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
- 0573US11715929B2System and apparatus for sequential transient liquid phase bondingAEVA INC·Filed 2022·Granted Aug 1, 2023·0 cites·14 claims
- 0667US2023305245A1Techniques for optical sub-assembly and packagingAEVA INC·Filed 2023·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →