Inventor

HASHII TOMOHIRO

JP20 patents

⚠️ This page may combine multiple inventors who share the name “HASHII TOMOHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HASHII TOMOHIRO

SUMCO CORP

Apparatus for etching wafer by single-wafer process

Single wafer etching method

Method for manufacturing silicon wafers

Method of lapping semiconductor wafer and semiconductor wafer

Etching liquid for controlling silicon wafer surface shape and method for manufacturing silicon wafer using the same

Wafer separation apparatus and method, and method for manufacturing silicon wafer

Wafer polishing apparatus and method for polishing wafers

Process for producing silicon wafer

Method for processing semiconductor wafer

Machining process for semiconductor wafer

Method for smoothing wafer surface and apparatus used therefor

SUMITOMO METAL IND

Semiconductor wafer manufacturing method

Method of manufacturing semiconductor wafer

Semiconductor wafer grinding method

KOYATA SAKAE

Method for manufacturing epitaxial wafer

Method for etching single wafer

Apparatus for etching wafer by single-wafer process and single wafer type method for etching wafer

HASHII TOMOHIRO

Method of grinding semiconductor wafers, grinding surface plate, and grinding device

Fixed abrasive-grain processing device, method of fixed abrasive-grain processing, and method for producing semiconductor wafer

KUROSAWA YOSHIAKI

Polishing solution distribution apparatus and polishing apparatus having the same