Inventor
TAKAISHI KAZUSHIGE
JP27 patents
⚠️ This page may combine multiple inventors who share the name “TAKAISHI KAZUSHIGE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SUMCO CORP
14 patentsUS7488400B2Feb 10, 2009
Apparatus for etching wafer by single-wafer process
SUMCO CORP7 citations73
US7338904B2Mar 4, 2008
Method for manufacturing single-side mirror surface wafer
SUMCO CORP7 citations67
US7998867B2Aug 16, 2011
Method for manufacturing epitaxial wafer
SUMCO CORP2 citations62
US7906438B2Mar 15, 2011
Single wafer etching method
SUMCO CORP5 citations62
US7645702B2Jan 12, 2010
Manufacturing method of silicon wafer
SUMCO CORP4 citations62
US7601644B2Oct 13, 2009
Method for manufacturing silicon wafers
SUMCO CORP6 citations62
US7601642B2Oct 13, 2009
Method of processing silicon wafer
SUMCO CORP2 citations62
US12500089B2Dec 16, 2025
Wafer polishing method and wafer producing method
SUMCO CORP0 citations52
US12311496B2May 27, 2025
Method of double-side polishing work, method of producing work, and double-side polishing apparatus for a work
SUMCO CORP0 citations51
US7851375B2Dec 14, 2010
Alkaline etchant for controlling surface roughness of semiconductor wafer
SUMCO CORP1 citations51
US7717768B2May 18, 2010
Wafer polishing apparatus and method for polishing wafers
SUMCO CORP0 citations51
US7648890B2Jan 19, 2010
Process for producing silicon wafer
SUMCO CORP1 citations51
US7955982B2Jun 7, 2011
Method for smoothing wafer surface and apparatus used therefor
SUMCO CORP0 citations41
US7955440B2Jun 7, 2011
Method for cleaning silicon wafer and apparatus for cleaning the silicon wafer
SUMCO CORP0 citations39
KOYATA SAKAE
3 patentsUS8759229B2Jun 24, 2014
Method for manufacturing epitaxial wafer
KOYATA SAKAE2 citations60
US8466071B2Jun 18, 2013
Method for etching single wafer
KOYATA SAKAE3 citations60
US8066896B2Nov 29, 2011
Apparatus for etching wafer by single-wafer process and single wafer type method for etching wafer
KOYATA SAKAE0 citations49