Inventor
HUANG CHE-HUNG
TW19 patents
⚠️ This page may combine multiple inventors who share the name “HUANG CHE-HUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
10 patentsUS12027604B2Jul 2, 2024
High electron mobility transistor and method for fabricating the same
UNITED MICROELECTRONICS CORP1 citations73
US11894441B2Feb 6, 2024
High electron mobility transistor and method for fabricating the same
UNITED MICROELECTRONICS CORP2 citations73
US11735644B2Aug 22, 2023
High electron mobility transistor and method for fabricating the same
UNITED MICROELECTRONICS CORP3 citations73
US11367779B2Jun 21, 2022
High electron mobility transistor and method for fabricating the same
UNITED MICROELECTRONICS CORP2 citations73
US10079180B1Sep 18, 2018
Method of forming a semiconductor device
UNITED MICROELECTRONICS CORP5 citations69
US12328889B2Jun 10, 2025
High electron mobility transistor and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations62
US11239338B2Feb 1, 2022
High electron mobility transistor and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations62
US11665888B2May 30, 2023
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations61
US10910386B2Feb 2, 2021
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP1 citations61
US11749740B2Sep 5, 2023
High electron mobility transistor and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations50
HTC CORP
4 patentsUS6749465B1Jun 15, 2004
Card connector with reinforcing structure
HTC CORP12 citations73
US6878260B2Apr 12, 2005
Process for forming a high-quality interface between a plated and a non-plated area
HTC CORP3 citations62
US8050040B2Nov 1, 2011
Flexible printed circuit board with improved reinforcing structure
HTC CORP3 citations58
US9220171B2Dec 22, 2015
Method of fabricating housing, housing, and electronic apparatus
HTC CORP0 citations41