Inventor · disambiguated record
Hiroshi Murai
Also filed as: MURAI HIROSHI
10 granted patents·7 pending applications·69 citations·filing 1974–2020
86Inventor score
Files withSPANSION LLC4TANAKA ELECTRONICS IND3ALMT CORP2MURAI HIROSHI2INST OF SOFTWARE SCIENT CONST1
Top patents by PatentIndex Score
17 records- 0169US6492593B2Gold wire for semiconductor element connection and semiconductor element connection methodTANAKA ELECTRONICS IND·Filed 2001·Granted Dec 10, 2002·18 cites·12 claims
- 0268US4234876AOmnidirectional move-stop sensorRIKEN DENSHI KOGYO KABUSHIKI K·Filed 1977·Granted Nov 18, 1980·23 cites·10 claims
- 0358US7083759B2Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directionsALMT CORP·Filed 2001·Granted Aug 1, 2006·10 cites·7 claims
- 0452US3931434AMethod of manufacturing dehydrated fruit used as an additive to powdered instant foodNAGATANIEN HONPO CO LTD·Filed 1974·Granted Jan 6, 1976·13 cites·4 claims
- 0551US7910980B2Sonos device with insulating storage layer and P-N junction isolationSPANSION LLC·Filed 2008·Granted Mar 22, 2011·0 cites·15 claims
- 0648US7645693B2Semiconductor device and programming method thereforSPANSION LLC·Filed 2006·Granted Jan 12, 2010·0 cites·12 claims
- 0747US2011058979A1Bonding wireTANAKA ELECTRONICS IND·Filed 2008·Application pending·0 cites
- 0844US2010171222A1HIGH RELIABILITY Au ALLOY BONDING WIRE AND SEMICONDUCTOR DEVICE OF SAMETANAKA ELECTRONICS IND·Filed 2008·Application pending·0 cites
- 0941US7825448B2U-shaped SONOS memory having an elevated source and drainSPANSION LLC·Filed 2008·Granted Nov 2, 2010·0 cites·8 claims
- 1041US2021001739A1Charge/discharge deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Application pending·0 cites
- 1140US2012007900A1Field-sequential color liquid crystal display and method for displaying colors thereofMURAI HIROSHI·Filed 2010·Application pending·0 cites
- 1240US2016272488A1Through electrode and method for producing multilayer substrate using through electrodeTANAKA PRECIOUS METAL IND·Filed 2014·Application pending·0 cites
- 1339US7736953B2Semiconductor memory and method of fabricating the sameSPANSION LLC·Filed 2005·Granted Jun 15, 2010·0 cites·12 claims
- 1439US2006246314A1Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directionsALMT CORP·Filed 2006·Application pending·0 cites
- 1537US2008050267A1Au Alloy Bonding WireMURAI HIROSHI·Filed 2005·Application pending·0 cites
- 1632US11939879B2Blade repair method, blade, and gas turbineMITSUBISHI HEAVY IND LTD·Filed 2020·Granted Mar 26, 2024·0 cites·7 claims
- 1717US5568642AComputer system with easy programming architecture and programming method thereforINST OF SOFTWARE SCIENT CONST·Filed 1996·Granted Oct 22, 1996·5 cites·8 claims
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