US2011058979A1PendingUtilityA1

Bonding wire

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Assignee: TANAKA ELECTRONICS INDPriority: Nov 6, 2007Filed: Sep 11, 2008Published: Mar 10, 2011
Est. expiryNov 6, 2027(~1.3 yrs left)· nominal 20-yr term from priority
C22C 5/02B23K 35/3013H10W 90/756H10W 72/07533H10W 72/07532H10W 72/07531H10W 72/07521H10W 72/07511H10W 72/07141H10W 72/5522H10W 72/5363H10W 72/01551H10W 72/952H10W 72/552H10W 72/536H10W 72/90H10W 72/075H10W 72/59H10W 72/015
47
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Claims

Abstract

[Issues to be Solved] Second bonding failures caused by attached oxide of additive elements on high purity Au bonding wire are to be resolved. [Solution Means] Au alloy bonding wires comprising: 5-100 wt ppm Mg, 5-20 wt ppm In, 5-20 wt ppm Al, 5-20 wt ppm Yb, and residual Au of 99.995 wt % purity or higher, and adding 5-20 wt ppm Ca, and for these alloys adding at least one element among 5-20 wt ppm La, 5-20 wt ppm Lu, 5-100 wt ppm Sn, 5-100 wt ppm Sr to the alloy, and/or, moreover, adding 0.01-1.2 wt % Pd to these alloys. Bonding wire, which contains these trace additive elements do not cause a disturbance by accumulated contamination, because of contamination, which formed at ball formation by micro discharge and at the first bonding on the tip of the capillary, transferring to the wire at second bonding.

Claims

exact text as granted — not AI-modified
1 . An Au alloy bonding wire comprising: 5-100 wt ppm Mg; 5-20 wt ppm In; 5-20 wt ppm Al; 5-20 wt ppm Yb; and residual Au of 99.995 wt % purity or higher. 
     
     
         2 . An Au alloy bonding wire comprising: 5-20 wt ppm Ca; 5-100 wt ppm Mg; 5-20 wt ppm In; 5-20 wt ppm Al; 5-20 wt ppm Yb; and residual Au of 99.995 wt % purity or higher. 
     
     
         3 . The Au alloy bonding wire as recited in  claim 1 , further comprising: at least one element selected from 5-20 wt ppm La, 5-20 wt ppm Lu, 5-100 wt ppm Sn, and 5-100 wt ppm Sr. 
     
     
         4 . The Au alloy bonding wire as recited in  claim 2 , further comprising: at least one element selected from 5-20 wt ppm La, 5-20 wt ppm Lu, 5-100 wt ppm Sn, and 5-100 wt ppm Sr. 
     
     
         5 . An Au alloy bonding wire comprising: 0.01-1.2 wt % Pd; 5-100 wt ppm Mg; 5-20 wt ppm In; 5-20 wt ppm Al; 5-20 wt ppm Yb; and residual Au of 99.995 wt % purity or higher. 
     
     
         6 . An Au alloy bonding wire comprising: 0.01-1.2 wt % Pd; 5-20 wt ppm Ca; 5-100 wt ppm Mg; 5-20 wt ppm In; 5-20 wt ppm Al; 5-20 wt ppm Yb; and residual Au of 99.995 wt % purity or higher. 
     
     
         7 . The Au alloy bonding wire as recited in  claim 5 , further comprising: at least one element selected from 5-20 wt ppm La, 5-20 wt ppm Lu, 5-100 wt ppm Sn, and 5-100 wt ppm Sr. 
     
     
         8 . The Au alloy bonding wire as recited in  claim 6 , further comprising: at least one element selected from 5-20 wt ppm La, 5-20 wt ppm Lu, 5-100 wt ppm Sn, and 5-100 wt ppm Sr.

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