Inventor · disambiguated record
Jun Chiba
Also filed as: CHIBA JUN
7 granted patents·4 pending applications·31 citations·filing 1997–2018
78Inventor score
Top patents by PatentIndex Score
11 records- 0171US5940245ADoor opening-and-closing mechanism of recording/reproducing apparatusALPS ELECTRIC CO LTD·Filed 1997·Granted Aug 17, 1999·26 cites·4 claims
- 0265US11251153B2Noble metal-coated silver wire for ball bonding, and semiconductor device using noble metal-coated silver wire for ball bondingTANAKA ELECTRONICS IND·Filed 2018·Granted Feb 15, 2022·1 cites·10 claims
- 0355US9972595B2Bonding wire for high-speed signal lineTANAKA ELECTRONICS IND·Filed 2013·Granted May 15, 2018·1 cites·9 claims
- 0455US9103001B2Ag—Au—Pd ternary alloy bonding wireCHIBA JUN·Filed 2011·Granted Aug 11, 2015·2 cites·11 claims
- 0547US2011058979A1Bonding wireTANAKA ELECTRONICS IND·Filed 2008·Application pending·0 cites
- 0644US11456271B2Noble metal-coated silver wire for ball bonding and method for producing the same, and semiconductor device using noble metal-coated silver wire for ball bonding and method for producing the sameTANAKA ELECTRONICS IND·Filed 2018·Granted Sep 27, 2022·0 cites·10 claims
- 0744US2010171222A1HIGH RELIABILITY Au ALLOY BONDING WIRE AND SEMICONDUCTOR DEVICE OF SAMETANAKA ELECTRONICS IND·Filed 2008·Application pending·0 cites
- 0839US2008013032A1Liquid crystal deviceCITIZEN WATCH CO LTD·Filed 2005·Application pending·0 cites
- 0937US9362249B2Silver—gold alloy bonding wireTANAKA ELECTRONICS IND·Filed 2015·Granted Jun 7, 2016·0 cites·5 claims
- 1037US2008050267A1Au Alloy Bonding WireMURAI HIROSHI·Filed 2005·Application pending·0 cites
- 1131US5896250AHead transport mechanism for disc drive apparatusALPS ELECTRIC CO LTD·Filed 1997·Granted Apr 20, 1999·1 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →