Inventor

COTTE JOHN M

US67 patents

⚠️ This page may combine multiple inventors who share the name “COTTE JOHN M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

COTTE JOHN M

IBM

Selective capping of copper wiring

Apparatus and method for increasing throughput in fluid processing

Integrated BEOL thin film resistor

Production of metal insulator metal (MIM) structures using anodizing process

High performance lithium polymer electrolyte battery

High energy density, flexible lithium primary batteries

Selective capping of copper wiring

Damascene integration scheme for developing metal-insulator-metal capacitors

Lithium polymer electrolyte battery for sub-ambient temperature applications

Noble metal contacts for micro-electromechanical switches

Semiconductor device including superconducting metal through-silicon-vias and method of manufacturing the same

Superconducting airbridge crossover using superconducting sacrificial material

Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers

Complementary metal oxide semiconductor device with an electroplated metal replacement gate

Method of fabricating a high Q factor integrated circuit inductor

Integrated BEOL thin film resistor

High Q factor integrated circuit inductor

Turbine part mount for supercritical fluid processor

Solid CO2 cleaning

Small area, robust silicon via structure and process

Production of metal insulator metal (MIM) structures using anodizing process

Method for BEOL resistor tolerance improvement using anodic oxidation

Method of in situ monitoring of supercritical fluid process conditions

Bump bonded cryogenic chip carrier

Multiple sized bump bonds

Non-destructive testing of integrated circuit chips

Superconducting airbridge crossover using superconducting sacrificial material

Integrated plating and planarization process and apparatus therefor

Superconducting airbridge crossover using superconducting sacrificial material

Small area, robust silicon via structure and process

Method of fabricating a high Q factor integrated circuit inductor

Method for the rapid thermal control of a work piece in liquid or supercritical fluid

Use of a reactive, or reducing gas as a method to increase contact lifetime in micro contact MEMS switch devices

Two-component bump metallization

Use of a reactive, or reducing gas as a method to increase contact lifetime in micro contact mems switch devices

Ta—TaN selective removal process for integrated device fabrication

Method of forming noble metal contacts

COTTE JOHN M

Electrodeposition under illumination without electrical contacts

Method to evaluate effectiveness of substrate cleanness and quantity of pin holes in an antireflective coating of a solar cell

Method to evaluate effectiveness of substrate cleanness and quantity of pin holes in an antireflective coating of a solar cell

Surface charge enabled nanoporous semi-permeable membrane for desalination

ANDRY PAUL S

Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers

High-yield method of exposing and contacting through-silicon vias

Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers

BASKER VEERARAGHAVAN S

Apparatus and method for electrochemical processing of thin films on resistive substrates

CHARNS LESLIE

Chemical mechanical planarization with overburden mask

CABRAL JR CRYIL

Implantless dopant segregation for silicide contacts

CHINTHAKINDI ANIL K

Integrated BEOL thin film resistor

CABRAL JR CYRIL

Method to electrodeposit nickel on silicon for forming controllable nickel silicide

SIMONS JOHN P

Apparatus and method for the rapid thermal control of a work piece in liquid or supercritical fluid