Inventor
RUBIN JOSHUA
US14 patents
⚠️ This page may combine multiple inventors who share the name “RUBIN JOSHUA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
12 patentsUS10535608B1Jan 14, 2020
Multi-chip package structure having chip interconnection bridge which provides power connections between chip and package substrate
IBM86 citations97
US10804204B2Oct 13, 2020
Multi-chip package structure having chip interconnection bridge which provides power connections between chip and package substrate
IBM19 citations94
US10217674B1Feb 26, 2019
Three-dimensional monolithic vertical field effect transistor logic gates
IBM16 citations92
US10573521B2Feb 25, 2020
Gate metal patterning to avoid gate stack attack due to excessive wet etching
IBM8 citations84
US10283411B1May 7, 2019
Stacked vertical transistor device for three-dimensional monolithic integration
IBM12 citations83
US11276576B2Mar 15, 2022
Gate metal patterning to avoid gate stack attack due to excessive wet etching
IBM2 citations73
US10679890B2Jun 9, 2020
Nanosheet structure with isolated gate
IBM2 citations73
US10546915B2Jan 28, 2020
Buried MIM capacitor structure with landing pads
IBM2 citations73
US10580738B2Mar 3, 2020
Direct bonded heterogeneous integration packaging structures
IBM4 citations71
US10325821B1Jun 18, 2019
Three-dimensional stacked vertical transport field effect transistor logic gate with buried power bus
IBM6 citations71
US11081542B2Aug 3, 2021
Buried MIM capacitor structure with landing pads
IBM0 citations62
US11177217B2Nov 16, 2021
Direct bonded heterogeneous integration packaging structures
IBM0 citations61