P

Inventor

HUANG TSUNG-MIN

TW42 patents
⚠️ This page may combine multiple inventors who share the name “HUANG TSUNG-MIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

24 patents
US9911646B2Mar 6, 2018

Self-aligned double spacer patterning process

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US9406614B2Aug 2, 2016

Material and process for copper barrier layer

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9947535B2Apr 17, 2018

Trench formation using horn shaped spacer

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9831117B2Nov 28, 2017

Self-aligned double spacer patterning process

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9818695B2Nov 14, 2017

Material and process for copper barrier layer

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9646932B2May 9, 2017

Method for forming interconnect structure that avoids via recess

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9576893B2Feb 21, 2017

Semiconductor structure and semiconductor fabricating process for the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10916443B2Feb 9, 2021

Spacer-damage-free etching

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US9576851B2Feb 21, 2017

Interconnect structure and methods of making same

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US10283371B2May 7, 2019

Spacer-damage-free etching

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10049878B2Aug 14, 2018

Self-aligned patterning process

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9806026B2Oct 31, 2017

Self repairing process for porous dielectric materials

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9768031B2Sep 19, 2017

Semiconductor device manufacturing methods

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9735048B2Aug 15, 2017

Semiconductor device and fabricating process for the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9728408B2Aug 8, 2017

Method of semiconductor integrated circuit fabrication

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9607850B2Mar 28, 2017

Self-aligned double spacer patterning process

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9601346B2Mar 21, 2017

Spacer-damage-free etching

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9514979B2Dec 6, 2016

Trench formation using horn shaped spacer

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9502249B2Nov 22, 2016

Masking process and structures formed thereby

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9449839B2Sep 20, 2016

Self-assembled monolayer for pattern formation

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations52
US9418862B2Aug 16, 2016

Method for integrated circuit patterning

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10186455B2Jan 22, 2019

Interconnect structure and methods of making same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9679803B2Jun 13, 2017

Method for forming different patterns in a semiconductor structure using a single mask

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations42
US9558927B2Jan 31, 2017

Wet cleaning method for cleaning small pitch features

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations42

TAIWAN SEMICONDUCTOR MFG

14 patents
US9184054B1Nov 10, 2015

Method for integrated circuit patterning

TAIWAN SEMICONDUCTOR MFG786 citations99
US9123776B2Sep 1, 2015

Self-aligned double spacer patterning process

TAIWAN SEMICONDUCTOR MFG26 citations93
US9252049B2Feb 2, 2016

Method for forming interconnect structure that avoids via recess

TAIWAN SEMICONDUCTOR MFG7 citations84
US9129906B2Sep 8, 2015

Self-aligned double spacer patterning process

TAIWAN SEMICONDUCTOR MFG6 citations84
US9099400B2Aug 4, 2015

Semiconductor device manufacturing methods

TAIWAN SEMICONDUCTOR MFG9 citations84
US8927413B2Jan 6, 2015

Semiconductor structure and semiconductor fabricating process for the same

TAIWAN SEMICONDUCTOR MFG8 citations84
US9368348B2Jun 14, 2016

Self-aligned patterning process

TAIWAN SEMICONDUCTOR MFG2 citations63
US9136162B2Sep 15, 2015

Trench formation using horn shaped spacer

TAIWAN SEMICONDUCTOR MFG3 citations63
US9129967B2Sep 8, 2015

Integrated circuit device having a copper interconnect

TAIWAN SEMICONDUCTOR MFG2 citations63
US9093386B2Jul 28, 2015

Spacer-damage-free etching

TAIWAN SEMICONDUCTOR MFG1 citations63
US9136166B2Sep 15, 2015

Interconnect structure and methods of making same

TAIWAN SEMICONDUCTOR MFG3 citations62
US9275873B2Mar 1, 2016

Masking process and structures formed thereby

TAIWAN SEMICONDUCTOR MFG1 citations52
US9257282B2Feb 9, 2016

Method of semiconductor integrated circuit fabrication

TAIWAN SEMICONDUCTOR MFG0 citations52
US8834671B2Sep 16, 2014

Apparatus and method for controlling silicon nitride etching tank

TAIWAN SEMICONDUCTOR MFG0 citations50

HUANG TSUNG-MIN

2 patents

WEI ZIN-CHANG

1 patent

HUANG CHIEN-HUA

1 patent