Inventor
RYU CHANG-SUP
KR43 patents
⚠️ This page may combine multiple inventors who share the name “RYU CHANG-SUP”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
30 patentsUS7282394B2Oct 16, 2007
Printed circuit board including embedded chips and method of fabricating the same using plating
SAMSUNG ELECTRO MECH114 citations98
US7350296B2Apr 1, 2008
Method of fabricating a printed circuit board including an embedded passive component
SAMSUNG ELECTRO MECH41 citations93
US7605459B2Oct 20, 2009
Coreless substrate and manufacturing thereof
SAMSUNG ELECTRO MECH21 citations92
US7277005B2Oct 2, 2007
Printed circuit board including embedded resistor and method of fabricating the same
SAMSUNG ELECTRO MECH34 citations92
US7564116B2Jul 21, 2009
Printed circuit board with embedded capacitors therein and manufacturing process thereof
SAMSUNG ELECTRO MECH33 citations91
US7351915B2Apr 1, 2008
Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating same
SAMSUNG ELECTRO MECH31 citations90
US7583512B2Sep 1, 2009
Printed circuit board including embedded passive component
SAMSUNG ELECTRO MECH14 citations84
US7485569B2Feb 3, 2009
Printed circuit board including embedded chips and method of fabricating the same
SAMSUNG ELECTRO MECH13 citations84
US7707715B2May 4, 2010
Method of fabricating multilayer printed circuit board
SAMSUNG ELECTRO MECH18 citations83
US7378326B2May 27, 2008
Printed circuit board with embedded capacitors therein and manufacturing process thereof
SAMSUNG ELECTRO MECH9 citations83
US7550316B2Jun 23, 2009
Board on chip package and manufacturing method thereof
SAMSUNG ELECTRO MECH5 citations74
US7394249B2Jul 1, 2008
Printed circuit board with weak magnetic field sensor
SAMSUNG ELECTRO MECH7 citations73
US9040838B2May 26, 2015
Method for forming solder resist and substrate for package
SAMSUNG ELECTRO MECH6 citations69
US8780584B2Jul 15, 2014
Printed circuit board and electro application
SAMSUNG ELECTRO MECH2 citations63
US7983055B2Jul 19, 2011
Printed circuit board with embedded cavity capacitor
SAMSUNG ELECTRO MECH2 citations63
US7506437B2Mar 24, 2009
Printed circuit board having chip package mounted thereon and method of fabricating same
SAMSUNG ELECTRO MECH3 citations62
US8377748B2Feb 19, 2013
Method of manufacturing cooling fin and package substrate with cooling fin
SAMSUNG ELECTRO MECH2 citations61
US8039174B2Oct 18, 2011
Flexible fuel cell
SAMSUNG ELECTRO MECH2 citations61
US7348772B2Mar 25, 2008
Printed circuit board having weak magnetic field sensor and method of manufacturing the same
SAMSUNG ELECTRO MECH3 citations61
US7337453B2Feb 26, 2008
Actuator employing a bobbin incorporating a winding coil and a manufacturing method thereof
SAMSUNG ELECTRO MECH3 citations61
US7622329B2Nov 24, 2009
Method for fabricating core substrate using paste bumps
SAMSUNG ELECTRO MECH2 citations60
US8022553B2Sep 20, 2011
Mounting substrate and manufacturing method thereof
SAMSUNG ELECTRO MECH3 citations58
US8003439B2Aug 23, 2011
Board on chip package and manufacturing method thereof
SAMSUNG ELECTRO MECH0 citations52
US7943864B2May 17, 2011
Printed circuit board having electromagnetic bandgap structure
SAMSUNG ELECTRO MECH1 citations52
US7901985B2Mar 8, 2011
Method for manufacturing package on package with cavity
SAMSUNG ELECTRO MECH0 citations52
US7328504B2Feb 12, 2008
Method for manufacturing circuit board with built-in electronic components
SAMSUNG ELECTRO MECH0 citations51
US7859106B2Dec 28, 2010
Multilayer printed circuit board using paste bumps
SAMSUNG ELECTRO MECH0 citations50
US9235129B2Jan 12, 2016
Composition for photoresist development and method of developing photoresist using the same
SAMSUNG ELECTRO MECH0 citations46
US7592708B2Sep 22, 2009
Package board, semiconductor package, and fabricating method thereof
SAMSUNG ELECTRO MECH0 citations42
US7973248B2Jul 5, 2011
Printed circuit board using paste bump and manufacturing method thereof
SAMSUNG ELECTRO MECH0 citations38
KIM HAN
5 patentsUS8432706B2Apr 30, 2013
Printed circuit board and electro application
KIM HAN6 citations84
US8966746B2Mar 3, 2015
Method of fabricating cavity capacitor embedded in printed circuit board
KIM HAN2 citations63
US8232478B2Jul 31, 2012
Electromagnetic interference noise reduction board using electromagnetic bandgap structure
KIM HAN1 citations52
US8169790B2May 1, 2012
Electromagnetic bandgap structure and printed circuit board
KIM HAN1 citations52
US8310840B2Nov 13, 2012
Electromagnetic bandgap structure and printed circuit board
KIM HAN0 citations42