Inventor
LIU KUO-CHUAN
TW33 patents
⚠️ This page may combine multiple inventors who share the name “LIU KUO-CHUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
17 patentsUS9664707B2May 30, 2017
Testing holders for chip unit and die package
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations93
US9453877B2Sep 27, 2016
Testing holders for chip unit and die package
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations93
US10698026B2Jun 30, 2020
Testing holders for chip unit and die package
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations84
US10685920B2Jun 16, 2020
Semiconductor device package with warpage control structure
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10067181B2Sep 4, 2018
Testing holders for chip unit and die package
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9831190B2Nov 28, 2017
Semiconductor device package with warpage control structure
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9780076B2Oct 3, 2017
Package-on-package structure with through molding via
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US9520385B1Dec 13, 2016
Package structure and method for forming same
TAIWAN SEMICONDUCTOR MFG CO LTD11 citations84
US9502323B2Nov 22, 2016
Method of forming encapsulated semiconductor device package
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US11340291B2May 24, 2022
Testing holders for chip unit and die package
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10163862B2Dec 25, 2018
Package structure and method for forming same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9543284B2Jan 10, 2017
3D packages and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11579190B2Feb 14, 2023
Testing holders for chip unit and die package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11764169B2Sep 19, 2023
Semiconductor device package with warpage control structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11329006B2May 10, 2022
Semiconductor device package with warpage control structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10008480B2Jun 26, 2018
Package-on-package structure with through molding via
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9502387B2Nov 22, 2016
Package-on-package structure with through molding via
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
FUJITSU LTD
6 patentsUS6800169B2Oct 5, 2004
Method for joining conductive structures and an electrical conductive article
FUJITSU LTD107 citations98
US6884313B2Apr 26, 2005
Method and system for joining and an ultra-high density interconnect
FUJITSU LTD56 citations96
US7224857B2May 29, 2007
Optical-routing boards for opto-electrical systems and methods and apparatuses for manufacturing the same
FUJITSU LTD17 citations84
US6885789B2Apr 26, 2005
Optical switch fabricated by a thin film process
FUJITSU LTD15 citations84
US7083869B2Aug 1, 2006
Methods of forming LaNiO3 conductive layers, ferro-electric devices with LaNiO3 layers, and precursor formation solutions
FUJITSU LTD2 citations63
US7261918B2Aug 28, 2007
Methods of forming lanthanum-modified lead zirconium titanate (PLZT) layers
FUJITSU LTD0 citations52
TAIWAN SEMICONDUCTOR MFG
5 patentsUS8941248B2Jan 27, 2015
Semiconductor device package and method
TAIWAN SEMICONDUCTOR MFG70 citations97
US9341671B2May 17, 2016
Testing holders for chip unit and die package
TAIWAN SEMICONDUCTOR MFG14 citations93
US9237647B2Jan 12, 2016
Package-on-package structure with through molding via
TAIWAN SEMICONDUCTOR MFG6 citations84
US8901732B2Dec 2, 2014
Semiconductor device package and method
TAIWAN SEMICONDUCTOR MFG12 citations84
US9252076B2Feb 2, 2016
3D packages and methods for forming the same
TAIWAN SEMICONDUCTOR MFG1 citations52