Inventor

NAGATOMO YOSHIYUKI

JP68 patents

⚠️ This page may combine multiple inventors who share the name “NAGATOMO YOSHIYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NAGATOMO YOSHIYUKI

MITSUBISHI MATERIALS CORP

Power module substrate

Liquid-cooled heat sink and manufacturing method thereof

Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint material

Circuit board, method of producing same, and power module

Power module and power module with heat sink

Power module substrate, method of producing the same, and semiconductor device including the substrate

Power module substrate, heat-sink-attached power-module substrate, and heat-sink-attached power module

Power module substrate, power module substrate with heatsink, power module, and method for producing power module substrate

Power module substrate, power module substrate with heat sink, and power module

Semiconductor device and ceramic circuit substrate, and producing method of semiconductor device

Bonded body, power module substrate, power module, method for manufacturing bonded body, and method for manufacturing power module substrate

Bonded body, power module substrate, method for manufacturing bonded body, and method for manufacturing power module substrate

Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink

Process for producing bonded body and process for producing power module substrate

Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink

Method for manufacturing bonded body and method for manufacturing power-module substrate

Bonded body and power module substrate

Copper-ceramic bonded body and power module substrate

Cu/ceramic bonded body, method for manufacturing Cu/ceramic bonded body, and power module substrate

Heat-sink-attached power module substrate, heat-sink-attached power module, and method for producing heat-sink-attached power module substrate

Power module substrate with Ag underlayer and power module

Method of producing bonded body and method of producing power module substrate

Method for manufacturing power module substrate

Substrate for power modules, substrate with heat sink for power modules, and power module

Power module substrate, heat-sink-attached power module substrate, and heat-sink-attached power module

Bonded body, power module substrate, power module and method for producing bonded body

Power module substrate, power module substrate with metal part, power module with metal part, method for producing power module substrate, and method for producing power module substrate with metal part

Bonded body and power module substrate

Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste

Power module

Power module

Power module substrate, power module, and method for manufacturing power module substrate

Method for producing bonded body, method for producing insulated circuit board, and method for producing insulated circuit board with heatsink

Semiconductor device

Ceramic substrate, method of manufacturing ceramic substrate, and method of manufacturing power module substrate

Method of manufacturing bonded body for insulation circuit substrate board and bonded body for insulation circuit substrate board

Insulated heat transfer substrate, thermoelectric conversion module, and method for manufacturing insulated heat transfer substrate

Method of manufacturing bonded body for insulation circuit substrate board and bonded body for insulation circuit substrate board

Insulation circuit board with heat sink

Solder joint structure, power module, power module substrate with heat sink and method of manufacturing the same, and paste for forming solder base layer

Power module substrate with heat sink, and method for producing power module substrate with heat sink

Power module

Bonded body, power module substrate, power module, method for manufacturing bonded body, and method for manufacturing power module substrate

Method of manufacturing power module substrate board and ceramic-copper bonded body

KUROMITSU YOSHIROU

Power module substrate, power module, and method for manufacturing power module substrate

Power module substrate, power module substrate with heat sink, power module, and method of manufacturing power module substrate

NAGASE TOSHIYUKI

Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint material

NAGATOMO YOSHIYUKI

Substrate for power module, substrate with heat sink for power module, power module, method for producing substrate for power module, and method for producing substrate with heat sink for power module

KITAHARA TAKESHI

Method for manufacturing power module substrate, power module substrate, and power module

TONOMURA HIROSHI

Method for producing substrate for power module with heat sink, substrate for power module with heat sink, and power module